The Asia Pacific Integrated Passive Devices Market would witness market growth of 11.4% CAGR during the forecast period (2022-2028).
Murata developed the NFZ03SG SN family of audio line noise filters for smartphones to effectively reduce noise while preserving good sound quality. IPDiA was also purchased by Murata. IPDiA is a producer of passive integrated devices. IPDiA was acquired by Murata Manufacturing a result of which IPDiA is now a subsidiary of Murata Manufacturing, and IPDiA's products and solutions are commercialized as a part of Murata's product line.
To commercialize these devices on a broad scale and hasten their acceptance across many applications, industry participants are stressing the introduction of practical production technologies such as wafer fabrication. The market for IPD-based technologies is anticipated to be driven by the use of these devices in IoT and implantable medical devices, among other applications.
Due to their low power consumption, LED goods are now used more frequently in electronic equipment like hard drives, smartphones, laptops, routers, and other fields including healthcare and the automobile. Wireless communication that is convenient and hassle-free is made possible by the usage of RF IPDs. Technologies like wafer technology are gaining popularity since they outperform the standard Copper-Silicon IPD technology in terms of performance. The adoption of wafer-based devices in electronics is anticipated to boost the industry's growth over the projection period due to their cost-effectiveness. Other materials, such as passive gold-on-GaAs products, are used in high-end medical applications, particularly implantable devices.
IPD, like RF devices, promotes effective wireless communication and guards against network signal loss. In addition to digital and mixed signals, RF transceivers, power amplifiers, MEMS, digital processors, and power control units, are utilized in a variety of applications. The large number of consumers adopting smartphones and other IoT devices can be ascribed to the increased penetration of these devices in the wireless consumer market. There are fewer but substantial uses for this technology in digital and mixed signals. The ability of an application to meet the electrical performance and density specifications of traditional DC-DC converter modules and high-performance silicon digital interposer substrates is a prerequisite for commercialization.
The People's Republic of China (PRC or China) has announced several new relevant policy initiatives since August 2020 to support the growth of its semiconductors and software industries. The Notice on Several Policies to Promote the High-quality Development of the Integrated Circuit Industry and Software Industry in the New Era, published by China's State Council in August 2020, offers a comprehensive framework. The Chinese government released several implementing measures in March 2021, which include requirements businesses must achieve to be eligible for government advantages as well as tax and tariff rules.
The China market dominated the Asia Pacific Integrated Passive Devices Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $309 Million by 2028.The Japan market is estimated to grow at a CAGR of 10.8% during (2022 - 2028). Additionally, The India market would experience a CAGR of 12.1% during (2022 - 2028).
Based on Application, the market is segmented into Electrostatic discharge/electromagnetic interference (ESD/EMI) Protection, Radio Frequency LED Lighting and Digital & Mixed-Signal. Based on End User, the market is segmented into Automotive, Consumer Electronics, Healthcare and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
Free Valuable Insights: The Worldwide Integrated Passive Devices Market is Projected to reach USD 3.6 Billion by 2028, at a CAGR of 10.9%
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include STMicroelectronics N.V., Infineon Technologies AG, Jiangsu Changjing Electronics Technology Co., Ltd., Amkor Technology, Inc., Taiwan Semiconductor Manufacturing Company Limited, ON Semiconductor Corporation, Murata Manufacturing Co., Ltd., Johanson Technology, Inc., and OnChip Devices, Inc.
By Application
By End User
By Country
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