The Asia Pacific High-Density Interconnect (HDI) PCB Market would witness market growth of 11.3% CAGR during the forecast period (2023-2030).
The value of commerce in the international importation of information and communications technology (ICT) items was driven by the demand for electronic components used in Internet of Things (IoT) devices. HDI technology is used by a lot of this sophisticated equipment. Businesses now track inventory and track the functioning of their equipment using electronic technologies. More and more modern machinery is equipped with smart sensors that gather usage statistics, connect to the Internet, and communicate or interact with other smart devices as well as with management to help improve operations.
Smart sensors are rapidly being installed in machines to gather usage information, communicate with smart devices, send information to management, and help optimize operations. Automobiles are advancing in connectivity and computerization, just like the rest of society. New capabilities are being added every day to the 5G technology, which is constantly developing. Therefore, it's critical for PCB makers to comprehend both the requirements for raw materials and the upgrading of equipment. It can also have a huge potential for growth to invest in the research and development of PCB assembly procedures to fulfil 5G specifications.
Several countries, including Japan, South Korea, China, and India, are notably advancing in the market due to their significant influence in technology, medical research, and power. With the ability to incorporate HDIs into diverse electrical gadgets, this region can proudly point to a booming consumer electronics industry. According to a report by the China Academy of Information and Communications Technology, China's electronics manufacturing sector expanded steadily during the first two months of 2023. The growing emphasis on healthcare and the increasing demand for cutting-edge medical technologies both contribute to the market's expansion in this region. The region's strong semiconductor sector and current R&D programs both contribute to the development and commercialization of HDIs.
The China market dominated the Asia Pacific High-Density Interconnect (HDI) PCB Market by Country in 2022 and would continue to be a dominant market till 2030; thereby, achieving a market value of $3,138.8 million by 2029. The Japan market is registering a CAGR of 10.6% during (2023 - 2030). Additionally, The India market would showcase a CAGR of 12% during (2023 - 2030).
Based on End User, the market is segmented into Consumer Electronics, Automotive, Industrial Electronics, IT & Telecommunications and Others. Based on Application, the market is segmented into Smartphone & Tablet, PC & Laptop, Smart Wearables and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
Free Valuable Insights: The Worldwide High-Density Interconnect (HDI) PCB Market is Projected to reach USD 26.9 Billion by 2030, at a CAGR of 10.9%
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include MEIKO ELECTRONICS CO., LTD., DAP CORPORATION, AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Unitech Printed Circuit Board Corp., FICT LIMITED (Fujitsu Limited), TTM Technologies, Inc., UNIMICRON TECHNOLOGY CORP., NCAB Group AB, Ibiden Co., Ltd. and Sierra Circuits, Inc.
Scope of the Study
Market Segments Covered in the Report:
By End User
- Consumer Electronics
- Automotive
- Industrial Electronics
- IT & Telecommunications
- Others
By Application
- Smartphone & Tablet
- PC & Laptop
- Smart Wearables
- Others
By Country
- China
- Japan
- India
- South Korea
- Singapore
- Malaysia
- Rest of Asia Pacific
Key Market Players
List of Companies Profiled in the Report:
- MEIKO ELECTRONICS CO., LTD.
- DAP CORPORATION
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Unitech Printed Circuit Board Corp.
- FICT LIMITED (Fujitsu Limited)
- TTM Technologies, Inc.
- UNIMICRON TECHNOLOGY CORP.
- NCAB Group AB
- Ibiden Co., Ltd.
- Sierra Circuits, Inc.
Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Asia Pacific High-Density Interconnect (HDI) PCB Market, by End User
1.4.2 Asia Pacific High-Density Interconnect (HDI) PCB Market, by Application
1.4.3 Asia Pacific High-Density Interconnect (HDI) PCB Market, by Country
1.5 Methodology for the research
Chapter 2. Market at a Glance
2.1 Key Highlights
Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition and Scenario
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Restraints
3.3 Porter Five Forces Analysis
Chapter 4. Asia Pacific High-Density Interconnect (HDI) PCB Market by End User
4.1 Asia Pacific Consumer Electronics Market by Country
4.2 Asia Pacific Automotive Market by Country
4.3 Asia Pacific Industrial Electronics Market by Country
4.4 Asia Pacific IT & Telecommunications Market by Country
4.5 Asia Pacific Others Market by Country
Chapter 5. Asia Pacific High-Density Interconnect (HDI) PCB Market by Application
5.1 Asia Pacific Smartphone & Tablet Market by Country
5.2 Asia Pacific PC & Laptop Market by Country
5.3 Asia Pacific Smart Wearables Market by Country
5.4 Asia Pacific Others Market by Country
Chapter 6. Asia Pacific High-Density Interconnect (HDI) PCB Market by Country
6.1 China High-Density Interconnect (HDI) PCB Market
6.1.1 China High-Density Interconnect (HDI) PCB Market by End User
6.1.2 China High-Density Interconnect (HDI) PCB Market by Application
6.2 Japan High-Density Interconnect (HDI) PCB Market
6.2.1 Japan High-Density Interconnect (HDI) PCB Market by End User
6.2.2 Japan High-Density Interconnect (HDI) PCB Market by Application
6.3 India High-Density Interconnect (HDI) PCB Market
6.3.1 India High-Density Interconnect (HDI) PCB Market by End User
6.3.2 India High-Density Interconnect (HDI) PCB Market by Application
6.4 South Korea High-Density Interconnect (HDI) PCB Market
6.4.1 South Korea High-Density Interconnect (HDI) PCB Market by End User
6.4.2 South Korea High-Density Interconnect (HDI) PCB Market by Application
6.5 Singapore High-Density Interconnect (HDI) PCB Market
6.5.1 Singapore High-Density Interconnect (HDI) PCB Market by End User
6.5.2 Singapore High-Density Interconnect (HDI) PCB Market by Application
6.6 Malaysia High-Density Interconnect (HDI) PCB Market
6.6.1 Malaysia High-Density Interconnect (HDI) PCB Market by End User
6.6.2 Malaysia High-Density Interconnect (HDI) PCB Market by Application
6.7 Rest of Asia Pacific High-Density Interconnect (HDI) PCB Market
6.7.1 Rest of Asia Pacific High-Density Interconnect (HDI) PCB Market by End User
6.7.2 Rest of Asia Pacific High-Density Interconnect (HDI) PCB Market by Application
Chapter 7. Company Profiles
7.1 MEIKO ELECTRONICS CO., LTD.
7.1.1 Company Overview
7.1.2 SWOT Analysis
7.2 DAP CORPORATION
7.2.1 Company Overview
7.2.2 SWOT Analysis
7.3 Unitech Printed Circuit Board Corp.
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Segmental and Regional Analysis
7.3.4 Research & Development Expenses
7.3.5 SWOT Analysis
7.4 FICT LIMITED (Fujitsu Limited)
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Segmental and Regional Analysis
7.4.4 Research & Development Expenses
7.4.5 SWOT Analysis
7.5 UNIMICRON TECHNOLOGY CORP.
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 Segmental and Regional Analysis
7.5.4 Research & Development Expenses
7.5.5 SWOT Analysis
7.6 NCAB Group AB
7.6.1 Company Overview
7.6.2 Financial Analysis
7.6.3 Segmental and Regional Analysis
7.6.4 SWOT Analysis
7.7 Ibiden Co., Ltd.
7.7.1 Company Overview
7.7.2 Financial Analysis
7.7.3 Segmental Analysis
7.7.4 Research & Development Expenses
7.7.5 SWOT Analysis
7.8 Sierra Circuits, Inc.
7.8.1 Company Overview
7.8.2 SWOT Analysis
7.9 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
7.9.1 Company Overview
7.9.2 Financial Analysis
7.9.3 Segmental and Regional Analysis
7.9.4 Research & Development Expenses
7.9.5 SWOT Analysis
7.10. TTM Technologies, Inc.
7.10.1 Company Overview
7.10.2 Financial Analysis
7.10.3 Segmental and Regional Analysis
7.10.4 Research & Development Expenses
7.10.5 SWOT Analysis
TABLE 1 Asia Pacific High-Density Interconnect (HDI) PCB Market, 2019 - 2022, USD Million
TABLE 2 Asia Pacific High-Density Interconnect (HDI) PCB Market, 2023 - 2030, USD Million
TABLE 3 Asia Pacific High-Density Interconnect (HDI) PCB Market by End User, 2019 - 2022, USD Million
TABLE 4 Asia Pacific High-Density Interconnect (HDI) PCB Market by End User, 2023 - 2030, USD Million
TABLE 5 Asia Pacific Consumer Electronics Market by Country, 2019 - 2022, USD Million
TABLE 6 Asia Pacific Consumer Electronics Market by Country, 2023 - 2030, USD Million
TABLE 7 Asia Pacific Automotive Market by Country, 2019 - 2022, USD Million
TABLE 8 Asia Pacific Automotive Market by Country, 2023 - 2030, USD Million
TABLE 9 Asia Pacific Industrial Electronics Market by Country, 2019 - 2022, USD Million
TABLE 10 Asia Pacific Industrial Electronics Market by Country, 2023 - 2030, USD Million
TABLE 11 Asia Pacific IT & Telecommunications Market by Country, 2019 - 2022, USD Million
TABLE 12 Asia Pacific IT & Telecommunications Market by Country, 2023 - 2030, USD Million
TABLE 13 Asia Pacific Others Market by Country, 2019 - 2022, USD Million
TABLE 14 Asia Pacific Others Market by Country, 2023 - 2030, USD Million
TABLE 15 Asia Pacific High-Density Interconnect (HDI) PCB Market by Application, 2019 - 2022, USD Million
TABLE 16 Asia Pacific High-Density Interconnect (HDI) PCB Market by Application, 2023 - 2030, USD Million
TABLE 17 Asia Pacific Smartphone & Tablet Market by Country, 2019 - 2022, USD Million
TABLE 18 Asia Pacific Smartphone & Tablet Market by Country, 2023 - 2030, USD Million
TABLE 19 Asia Pacific PC & Laptop Market by Country, 2019 - 2022, USD Million
TABLE 20 Asia Pacific PC & Laptop Market by Country, 2023 - 2030, USD Million
TABLE 21 Asia Pacific Smart Wearables Market by Country, 2019 - 2022, USD Million
TABLE 22 Asia Pacific Smart Wearables Market by Country, 2023 - 2030, USD Million
TABLE 23 Asia Pacific Others Market by Country, 2019 - 2022, USD Million
TABLE 24 Asia Pacific Others Market by Country, 2023 - 2030, USD Million
TABLE 25 Asia Pacific High-Density Interconnect (HDI) PCB Market by Country, 2019 - 2022, USD Million
TABLE 26 Asia Pacific High-Density Interconnect (HDI) PCB Market by Country, 2023 - 2030, USD Million
TABLE 27 China High-Density Interconnect (HDI) PCB Market, 2019 - 2022, USD Million
TABLE 28 China High-Density Interconnect (HDI) PCB Market, 2023 - 2030, USD Million
TABLE 29 China High-Density Interconnect (HDI) PCB Market by End User, 2019 - 2022, USD Million
TABLE 30 China High-Density Interconnect (HDI) PCB Market by End User, 2023 - 2030, USD Million
TABLE 31 China High-Density Interconnect (HDI) PCB Market by Application, 2019 - 2022, USD Million
TABLE 32 China High-Density Interconnect (HDI) PCB Market by Application, 2023 - 2030, USD Million
TABLE 33 Japan High-Density Interconnect (HDI) PCB Market, 2019 - 2022, USD Million
TABLE 34 Japan High-Density Interconnect (HDI) PCB Market, 2023 - 2030, USD Million
TABLE 35 Japan High-Density Interconnect (HDI) PCB Market by End User, 2019 - 2022, USD Million
TABLE 36 Japan High-Density Interconnect (HDI) PCB Market by End User, 2023 - 2030, USD Million
TABLE 37 Japan High-Density Interconnect (HDI) PCB Market by Application, 2019 - 2022, USD Million
TABLE 38 Japan High-Density Interconnect (HDI) PCB Market by Application, 2023 - 2030, USD Million
TABLE 39 India High-Density Interconnect (HDI) PCB Market, 2019 - 2022, USD Million
TABLE 40 India High-Density Interconnect (HDI) PCB Market, 2023 - 2030, USD Million
TABLE 41 India High-Density Interconnect (HDI) PCB Market by End User, 2019 - 2022, USD Million
TABLE 42 India High-Density Interconnect (HDI) PCB Market by End User, 2023 - 2030, USD Million
TABLE 43 India High-Density Interconnect (HDI) PCB Market by Application, 2019 - 2022, USD Million
TABLE 44 India High-Density Interconnect (HDI) PCB Market by Application, 2023 - 2030, USD Million
TABLE 45 South Korea High-Density Interconnect (HDI) PCB Market, 2019 - 2022, USD Million
TABLE 46 South Korea High-Density Interconnect (HDI) PCB Market, 2023 - 2030, USD Million
TABLE 47 South Korea High-Density Interconnect (HDI) PCB Market by End User, 2019 - 2022, USD Million
TABLE 48 South Korea High-Density Interconnect (HDI) PCB Market by End User, 2023 - 2030, USD Million
TABLE 49 South Korea High-Density Interconnect (HDI) PCB Market by Application, 2019 - 2022, USD Million
TABLE 50 South Korea High-Density Interconnect (HDI) PCB Market by Application, 2023 - 2030, USD Million
TABLE 51 Singapore High-Density Interconnect (HDI) PCB Market, 2019 - 2022, USD Million
TABLE 52 Singapore High-Density Interconnect (HDI) PCB Market, 2023 - 2030, USD Million
TABLE 53 Singapore High-Density Interconnect (HDI) PCB Market by End User, 2019 - 2022, USD Million
TABLE 54 Singapore High-Density Interconnect (HDI) PCB Market by End User, 2023 - 2030, USD Million
TABLE 55 Singapore High-Density Interconnect (HDI) PCB Market by Application, 2019 - 2022, USD Million
TABLE 56 Singapore High-Density Interconnect (HDI) PCB Market by Application, 2023 - 2030, USD Million
TABLE 57 Malaysia High-Density Interconnect (HDI) PCB Market, 2019 - 2022, USD Million
TABLE 58 Malaysia High-Density Interconnect (HDI) PCB Market, 2023 - 2030, USD Million
TABLE 59 Malaysia High-Density Interconnect (HDI) PCB Market by End User, 2019 - 2022, USD Million
TABLE 60 Malaysia High-Density Interconnect (HDI) PCB Market by End User, 2023 - 2030, USD Million
TABLE 61 Malaysia High-Density Interconnect (HDI) PCB Market by Application, 2019 - 2022, USD Million
TABLE 62 Malaysia High-Density Interconnect (HDI) PCB Market by Application, 2023 - 2030, USD Million
TABLE 63 Rest of Asia Pacific High-Density Interconnect (HDI) PCB Market, 2019 - 2022, USD Million
TABLE 64 Rest of Asia Pacific High-Density Interconnect (HDI) PCB Market, 2023 - 2030, USD Million
TABLE 65 Rest of Asia Pacific High-Density Interconnect (HDI) PCB Market by End User, 2019 - 2022, USD Million
TABLE 66 Rest of Asia Pacific High-Density Interconnect (HDI) PCB Market by End User, 2023 - 2030, USD Million
TABLE 67 Rest of Asia Pacific High-Density Interconnect (HDI) PCB Market by Application, 2019 - 2022, USD Million
TABLE 68 Rest of Asia Pacific High-Density Interconnect (HDI) PCB Market by Application, 2023 - 2030, USD Million
TABLE 69 Key Information – MEIKO ELECTRONICS CO., LTD.
TABLE 70 Key Information – DAP CORPORATION
TABLE 71 Key Information – Unitech Printed Circuit Board Corp.
TABLE 72 Key Information – FICT LIMITED
TABLE 73 Key Information – UNIMICRON TECHNOLOGY CORP.
TABLE 74 Key Information – NCAB Group AB
TABLE 75 Key Information – Ibiden Co., Ltd.
TABLE 76 Key Information – Sierra Circuits, Inc.
TABLE 77 Key Information – AT&S Group
TABLE 78 Key Information – TTM Technologies, Inc.
List of Figures
FIG 1 Methodology for the research
FIG 2 Asia Pacific High-Density Interconnect (HDI) PCB Market, 2019 - 2030, USD Million
FIG 3 Key Factors Impacting High-Density Interconnect (HDI) PCB Market
FIG 4 Porter’s Five Forces Analysis – High-Density Interconnect (HDI) PCB Market
FIG 5 Asia Pacific High-Density Interconnect (HDI) PCB Market share by End User, 2022
FIG 6 Asia Pacific High-Density Interconnect (HDI) PCB Market share by End User, 2030
FIG 7 Asia Pacific High-Density Interconnect (HDI) PCB Market by End User, 2019 - 2030, USD Million
FIG 8 Asia Pacific High-Density Interconnect (HDI) PCB Market share by Application, 2022
FIG 9 Asia Pacific High-Density Interconnect (HDI) PCB Market share by Application, 2030
FIG 10 Asia Pacific High-Density Interconnect (HDI) PCB Market by Application, 2019 - 2030, USD Million
FIG 11 Asia Pacific High-Density Interconnect (HDI) PCB Market share by Country, 2022
FIG 12 Asia Pacific High-Density Interconnect (HDI) PCB Market share by Country, 2030
FIG 13 Asia Pacific High-Density Interconnect (HDI) PCB Market by Country, 2019 - 2030, USD Million
FIG 14 SWOT Analysis: MEIKO ELECTRONICS CO., LTD.
FIG 15 SWOT Analysis: DAP CORPORATION
FIG 16 SWOT Analysis: Unitech Printed Circuit Board Corp.
FIG 17 SWOT Analysis: FICT LIMITED
FIG 18 SWOT Analysis: UNIMICRON TECHNOLOGY CORP.
FIG 19 SWOT Analysis: NCAB Group AB
FIG 20 SWOT Analysis: Ibiden Co., Ltd.
FIG 21 SWOT Analysis: Sierra Circuits, Inc.
FIG 22 SWOT Analysis: AT& S Austria Technologie & Systemtechnik Aktiengesellschaft
FIG 23 SWOT Analysis: TTM Technologies, Inc.