The Asia Pacific Embedded Die Packaging Technology Market would witness market growth of 18.9% CAGR during the forecast period (2022-2028).
Embedded die packaging has excellent electrical performance at high frequencies, making it a potential method for developing microwave applications. The need for compact electrical circuitry is growing as electronic gadgets become smaller to make them more accessible for people to operate.
This desire is satisfied by embedded die packaging technology, which has benefits including excellent reliability, higher signal density, smaller size, signal inductance, and power inductance, as well as increased functionality and efficiency of the electronic circuit. In addition, with embedded die packaging, unlike previous approaches, the die is embedded and takes up no space on the chip.
The need for disruptive technologies such as IOT in the area would be driven by the need for smart building and space solutions in highly populated regions. Therefore, much money is being invested in the internet of things solutions by the rapidly rising economies of China, Japan, South Korea, Singapore, and India. Additionally, to enhance safety and quality of life, the regulatory organizations of these nations are working very hard to build smart city initiatives. The government of Singapore released a Smart Nation Plan in 2017 to develop into a global digital center. The government is attempting to use IoT technology to enhance city living. These components are anticipated to provide growth opportunities for embedded die packaging technology in the local market.
The China market dominated the Asia Pacific Embedded Die Packaging Technology Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $27,074.5 Thousands by 2028.The Japan market is estimated to grow a CAGR of 18.2% during (2022 - 2028). Additionally, The India market would experience a CAGR of 19.7% during (2022 - 2028).
Based on Vertical, the market is segmented into Consumer Electronics, IT & Telecommunication, Automotive, Healthcare and Others. Based on Platform, the market is segmented into Embedded Die in IC Package Substrate, Embedded Die in Rigid Board and Embedded Die in Flexible Board. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
Free Valuable Insights: The Worldwide Embedded Die Packaging Technology Market is Projected to reach USD 214.1 Million by 2028, at a CAGR of 18.6%
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include General Electric (GE) Co., Infineon Technologies AG, TDK Corporation, Fujikura Ltd., Amkor Technology, Inc., Taiwan Semiconductor Manufacturing Company Limited, ASE Group (ASE Technology Holding), Microsemi Corporation (Microchip Technology), Schweizer Electronic AG (Wus Printed Circuit), and AT&S Group.
Scope of the Study
Market Segments Covered in the Report:
By Vertical
- Consumer Electronics
- IT & Telecommunication
- Automotive
- Healthcare
- Others
By Platform
- Embedded Die in IC Package Substrate
- Embedded Die in Rigid Board
- Embedded Die in Flexible Board
By Country
- China
- Japan
- India
- South Korea
- Singapore
- Malaysia
- Rest of Asia Pacific
Key Market Players
List of Companies Profiled in the Report:
- General Electric (GE) Co.
- Infineon Technologies AG
- TDK Corporation
- Fujikura Ltd.
- Amkor Technology, Inc.
- Taiwan Semiconductor Manufacturing Company Limited
- ASE Group (ASE Technology Holding)
- Microsemi Corporation (Microchip Technology)
- Schweizer Electronic AG (Wus Printed Circuit)
- AT&S Group
Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Asia Pacific Embedded Die Packaging Technology Market, by Vertical
1.4.2 Asia Pacific Embedded Die Packaging Technology Market, by Platform
1.4.3 Asia Pacific Embedded Die Packaging Technology Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition & Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Strategies Deployed in Embedded Die Packaging Technology Market
Chapter 4. Asia Pacific Embedded Die Packaging Technology Market by Vertical
4.1 Asia Pacific Consumer Electronics Market by Country
4.2 Asia Pacific IT & Telecommunication Market by Country
4.3 Asia Pacific Automotive Market by Country
4.4 Asia Pacific Healthcare Market by Country
4.5 Asia Pacific Others Market by Country
Chapter 5. Asia Pacific Embedded Die Packaging Technology Market by Platform
5.1 Asia Pacific Embedded Die in IC Package Substrate Market by Country
5.2 Asia Pacific Embedded Die in Rigid Board Market by Country
5.3 Asia Pacific Embedded Die in Flexible Board Market by Country
Chapter 6. Asia Pacific Embedded Die Packaging Technology Market by Country
6.1 China Embedded Die Packaging Technology Market
6.1.1 China Embedded Die Packaging Technology Market by Vertical
6.1.2 China Embedded Die Packaging Technology Market by Platform
6.2 Japan Embedded Die Packaging Technology Market
6.2.1 Japan Embedded Die Packaging Technology Market by Vertical
6.2.2 Japan Embedded Die Packaging Technology Market by Platform
6.3 India Embedded Die Packaging Technology Market
6.3.1 India Embedded Die Packaging Technology Market by Vertical
6.3.2 India Embedded Die Packaging Technology Market by Platform
6.4 South Korea Embedded Die Packaging Technology Market
6.4.1 South Korea Embedded Die Packaging Technology Market by Vertical
6.4.2 South Korea Embedded Die Packaging Technology Market by Platform
6.5 Singapore Embedded Die Packaging Technology Market
6.5.1 Singapore Embedded Die Packaging Technology Market by Vertical
6.5.2 Singapore Embedded Die Packaging Technology Market by Platform
6.6 Malaysia Embedded Die Packaging Technology Market
6.6.1 Malaysia Embedded Die Packaging Technology Market by Vertical
6.6.2 Malaysia Embedded Die Packaging Technology Market by Platform
6.7 Rest of Asia Pacific Embedded Die Packaging Technology Market
6.7.1 Rest of Asia Pacific Embedded Die Packaging Technology Market by Vertical
6.7.2 Rest of Asia Pacific Embedded Die Packaging Technology Market by Platform
Chapter 7. Company Profiles
7.1 General Electric (GE) Co.
7.1.1 Company Overview
7.1.2 Financial Analysis
7.1.3 Segmental and Regional Analysis
7.1.4 Research & Development Expense
7.1.5 SWOT Analysis
7.2 Infineon Technologies AG
7.2.1 Company Overview
7.2.2 Financial Analysis
7.2.3 Segmental and Regional Analysis
7.2.4 Research & Development Expense
7.2.5 Recent strategies and developments:
7.2.5.1 Acquisition and Mergers:
7.2.5.2 Geographical Expansions:
7.2.6 SWOT Analysis
7.3 TDK Corporation
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Regional & Segmental Analysis
7.3.4 Research & Development Expenses
7.3.5 Recent strategies and developments:
7.3.5.1 Product Launches and Product Expansions:
7.3.5.2 Acquisition and Mergers:
7.4 Fujikura Ltd.
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Segmental and Regional Analysis
7.4.4 Research & Development Expenses
7.5 Amkor Technology, Inc.
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 Regional Analysis
7.5.4 Research & Development Expense
7.5.5 Recent strategies and developments:
7.5.5.1 Geographical Expansions:
7.6 Taiwan Semiconductor Manufacturing Company Limited
7.6.1 Company overview
7.6.2 Financial Analysis
7.6.3 Regional Analysis
7.6.4 Research & Development Expenses
7.6.5 Recent strategies and developments:
7.6.5.1 Partnerships, Collaborations, and Agreements:
7.7 ASE Group (ASE Technology Holding)
7.7.1 Company Overview
7.7.2 Financial Analysis
7.7.3 Segmental and Regional Analysis
7.7.4 Research & Development Expenses
7.7.5 Recent strategies and developments:
7.7.5.1 Partnerships, Collaborations, and Agreements:
7.7.5.2 Product Launches and Product Expansions:
7.8 Microsemi Corporation (Microchip Technology)
7.8.1 Company Overview
7.8.2 Financial Analysis
7.8.3 Segmental and Regional Analysis
7.8.4 Research & Development Expenses
7.9 Schweizer Electronic AG (Wus Printed Circuit)
7.9.1 Company Overview
7.9.2 Financial Analysis
7.9.3 Regional Analysis
7.9.4 Research & Development Expenses
7.10. AT&S Group
7.10.1 Company Overview
7.10.2 Financial Analysis
7.10.3 Segmental and Regional Analysis
7.10.4 Research & Development Expenses
TABLE 1 Asia Pacific Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
TABLE 2 Asia Pacific Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
TABLE 3 Asia Pacific Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
TABLE 4 Asia Pacific Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
TABLE 5 Asia Pacific Consumer Electronics Market by Country, 2018 - 2021, USD Thousands
TABLE 6 Asia Pacific Consumer Electronics Market by Country, 2022 - 2028, USD Thousands
TABLE 7 Asia Pacific IT & Telecommunication Market by Country, 2018 - 2021, USD Thousands
TABLE 8 Asia Pacific IT & Telecommunication Market by Country, 2022 - 2028, USD Thousands
TABLE 9 Asia Pacific Automotive Market by Country, 2018 - 2021, USD Thousands
TABLE 10 Asia Pacific Automotive Market by Country, 2022 - 2028, USD Thousands
TABLE 11 Asia Pacific Healthcare Market by Country, 2018 - 2021, USD Thousands
TABLE 12 Asia Pacific Healthcare Market by Country, 2022 - 2028, USD Thousands
TABLE 13 Asia Pacific Others Market by Country, 2018 - 2021, USD Thousands
TABLE 14 Asia Pacific Others Market by Country, 2022 - 2028, USD Thousands
TABLE 15 Asia Pacific Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
TABLE 16 Asia Pacific Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
TABLE 17 Asia Pacific Embedded Die in IC Package Substrate Market by Country, 2018 - 2021, USD Thousands
TABLE 18 Asia Pacific Embedded Die in IC Package Substrate Market by Country, 2022 - 2028, USD Thousands
TABLE 19 Asia Pacific Embedded Die in Rigid Board Market by Country, 2018 - 2021, USD Thousands
TABLE 20 Asia Pacific Embedded Die in Rigid Board Market by Country, 2022 - 2028, USD Thousands
TABLE 21 Asia Pacific Embedded Die in Flexible Board Market by Country, 2018 - 2021, USD Thousands
TABLE 22 Asia Pacific Embedded Die in Flexible Board Market by Country, 2022 - 2028, USD Thousands
TABLE 23 Asia Pacific Embedded Die Packaging Technology Market by Country, 2018 - 2021, USD Thousands
TABLE 24 Asia Pacific Embedded Die Packaging Technology Market by Country, 2022 - 2028, USD Thousands
TABLE 25 China Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
TABLE 26 China Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
TABLE 27 China Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
TABLE 28 China Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
TABLE 29 China Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
TABLE 30 China Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
TABLE 31 Japan Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
TABLE 32 Japan Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
TABLE 33 Japan Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
TABLE 34 Japan Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
TABLE 35 Japan Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
TABLE 36 Japan Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
TABLE 37 India Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
TABLE 38 India Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
TABLE 39 India Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
TABLE 40 India Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
TABLE 41 India Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
TABLE 42 India Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
TABLE 43 South Korea Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
TABLE 44 South Korea Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
TABLE 45 South Korea Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
TABLE 46 South Korea Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
TABLE 47 South Korea Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
TABLE 48 South Korea Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
TABLE 49 Singapore Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
TABLE 50 Singapore Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
TABLE 51 Singapore Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
TABLE 52 Singapore Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
TABLE 53 Singapore Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
TABLE 54 Singapore Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
TABLE 55 Malaysia Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
TABLE 56 Malaysia Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
TABLE 57 Malaysia Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
TABLE 58 Malaysia Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
TABLE 59 Malaysia Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
TABLE 60 Malaysia Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
TABLE 61 Rest of Asia Pacific Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
TABLE 62 Rest of Asia Pacific Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
TABLE 63 Rest of Asia Pacific Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
TABLE 64 Rest of Asia Pacific Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
TABLE 65 Rest of Asia Pacific Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
TABLE 66 Rest of Asia Pacific Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
TABLE 67 Key Information – General Electric (GE) Co.
TABLE 68 Key Information – Infineon Technologies AG
TABLE 69 Key information – TDK Corporation
TABLE 70 Key Information – Fujikura Ltd.
TABLE 71 Key Information – Amkor Technology, Inc.
TABLE 72 Key Information– Taiwan Semiconductor Manufacturing Company Limited
TABLE 73 Key Information – ASE Group
TABLE 74 Key Information – Microsemi Corporation
TABLE 75 Key Information – Schweizer Electronic AG
TABLE 76 Key Information – AT&S Group
List of Figures
FIG 1 Methodology for the research
FIG 2 Swot analysis: General electric (GE) Co.
FIG 3 Recent strategies and developments: Infenion Technologies AG
FIG 4 Swot analysis: INFINEON TECHNOLOGIES AG
FIG 5 Recent strategies and developments: TDK Corporation