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The Asia Pacific Atomic Layer Deposition (ALD) Market would witness market growth of 13.5% CAGR during the forecast period (2017 - 2023). Atomic Layer Deposition (ALD) is among the superior forms of deposition methods which are used to produce thin and conformal films. The technology is used in the fabrication of semiconductor devices, and is also a part of the set of tools available for the synthesis of nano-technology materials.
The Asia Pacific was the dominant region due to rapidly growing demand for semiconductors, electronics, medical equipment, and solar devices. The deep-rooted electronics manufacturing base in South Korea, China and Taiwan have contributed to the demand for the deposition technologies. The thriving manufacturing of electronics products, modernization, and growing economies coupled with rising consumer electronics spending have added to the growth in the Asia Pacific region.
Based on Product, the market report segments the market into Aluminium Oxide ALD, Metal ALD, Plasma Enhanced ALD, Catalytic ALD, and Others. Based on End User, the Asia Pacific Atomic Layer Deposition (ALD) market segments the market into Aluminium Oxide ALD, Metal ALD, Plasma Enhanced ALD, Catalytic ALD, and Others.
Based on Countries, the Asia Pacific Atomic Layer Deposition (ALD) market segments the market into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific. The market research report covers the analysis of key stakeholders of the Asia Pacific Atomic Layer Deposition (ALD) Market. Key companies profiled in the report include Adeka Corporation, Aixtron SE, Applied Materials, Inc., ASM International NV, Lam Research Corporation, Tokyo Electron Limited, Denton Vacuum, Kurt J. Lesker Company, Beneq Oy, and Veeco Instruments.