Published Date: 20-Jan-2023
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According to a new report, published by KBV research, The Global Through-hole Passive Components Market size is expected to reach $50.3 billion by 2028, rising at a market growth of 5.9% CAGR during the forecast period.
The Radial market is exhibiting a CAGR of 8.7% during (2022 - 2028). Two pins lead emerging out from the same end of a component are referred to as radial leads. This configuration results in the protrusion of the lead from the circuit board surface and hence preserves the axial space. Radial leads are widely used in circuit boards with dense assemblies like the high-density interconnect (HDI) PCB.
The Consumer Electronics market is leading the segment in the Global Through-hole Passive Components Market by Application in 2021; thereby, achieving a market value of $13.4 billion by 2028. The growth of the segment is attributed to the growing demand for devices and electronic gadgets like smartphones, smart home appliances, wearable devices, etc.
The Sensors market is showcasing a CAGR of 5.3% during (2022 - 2028). Sensors are part of devices that indicate the changes occurred in their surroundings by reacting to them and displaying that interpretation on a screen. Sensors are widely used in present day-to-day applications like temperature measurement, animal tracking, high-end security features like autonomous driving and advanced driver assistance systems (ADAS), fault detection, smart lighting, and traffic monitoring.
The Asia Pacific market dominated the Global Through-hole Passive Components Market by Region in 2021; thereby, achieving a market value of $19.5 billion by 2028. The Europe market is poised to grow at a CAGR of 5.2% during (2022 - 2028). Additionally, The North America market would witness a CAGR of 5.7% during (2022 - 2028).
The market research report has exhaustive quantitative insights providing a clear picture of the market potential in various segments across the globe with country wise analysis in each discussed region. The key impacting factors of the market have been discussed in the report with the elaborated company profiles of Vishay Intertechnology, Inc., Yageo Corporation, Murata Manufacturing Co., Ltd., KYOCERA AVX Components Corporation (Kyocera Corporation), Panasonic Corporation, Bourns, Inc., TDK Corporation, TE Connectivity and Microchip Technology, Inc.
By Leads Model
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