The Global Thin Wafer Market is Predict to reach $22.2 Billion by 2028, at a CAGR of 13%

Published Date: 24-Nov-2022

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Thin Wafer Market Growth, Trends and Report Highlights

According to a new report, published by KBV research, The Global Thin Wafer Market size is expected to reach $22.2 billion by 2028, rising at a market growth of 13.0% CAGR during the forecast period.

The 200 mm market is showcasing a CAGR of 13.6% during (2022 - 2028). It is because market leaders in power devices like Metal-Oxide-Semiconductor Insulated-Gate Bipolar Transistor (IGBT), Field-Effect Transistor (MOSFET), and Radio Frequency (RF) devices are increasingly adopting 200 mm wafers. The wafer sector is preparing several strategic measures to meet the rising demand.

The Dicing market acquired the high revenue share in the Global Thin Wafer Market by Technology in 2021, thereby, achieving a market value of $9.8 billion by 2028. Ultra-thin wafer dicing is necessary because of ongoing package downsizing and memory capacity growth. The use of RFID tags and SIP (system in package) for cellphones and other small electrical devices has grown in recent years. As a result, the number of finished semiconductors dies with a thickness of less than or equal to 100 m has grown quickly.

The MEMS market shows the high growth rate of 13.4% during (2022 - 2028). Micro-Electro-Mechanical Systems, or MEMS, are a technology that, in their broadest sense, can be characterized as miniature mechanical and electro-mechanical components (i.e., devices and structures), and created utilizing microfabrication processes.

The Asia Pacific market dominated the Global Thin Wafer Market by Region in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $8.2 billion by 2028. The Europe market is anticipated to grow at a CAGR of 12.6% during (2022 - 2028). Additionally, The North America market would witness a CAGR of 12.4% during (2022 - 2028).

Full Report:

The market research report has exhaustive quantitative insights providing a clear picture of the market potential in various segments across the globe with country wise analysis in each discussed region. The key impacting factors of the market have been discussed in the report with the elaborated company profiles of Shin-Etsu Chemical Co., Ltd., SUMCO Corporation, GlobalWafers Co., Ltd., Siltronic AG, SK Siltron Co., Ltd., SUSS MicroTec SE, Soitec, DISCO Corporation, 3M Company, and Applied Materials, Inc.

Global Thin Wafer Market Segmentation

By Wafer Size

  • 300 mm
  • 200 mm
  • 125 mm

By Technology

  • Dicing
  • Polishing
  • Grinding

By Application

  • Memory
  • LED
  • MEMS
  • CIS
  • RF Devices
  • Interposer
  • Logic
  • Others

By Geography

  • North America
    • US
    • Canada
    • Mexico
    • Rest of North America
  • Europe
    • Germany
    • UK
    • France
    • Russia
    • Spain
    • Italy
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Singapore
    • Malaysia
    • Rest of Asia Pacific
    • Brazil
    • Argentina
    • UAE
    • Saudi Arabia
    • South Africa
    • Nigeria
    • Rest of LAMEA

Companies Profiled

  • Shin-Etsu Chemical Co., Ltd.
  • SUMCO Corporation
  • GlobalWafers Co., Ltd.
  • Siltronic AG
  • SK Siltron Co., Ltd.
  • SUSS MicroTec SE
  • Soitec
  • DISCO Corporation
  • 3M Company
  • Applied Materials, Inc.

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Related Reports:

North America Thin Wafer Market Future Scope & Opportunities 2022-2028

Europe Thin Wafer Market Size & Growth Forecast 2022-2028

Asia Pacific Thin Wafer Market Size, Share & Industry Outlook to 2028

LAMEA Thin Wafer Market Growth, Trends & Forecasts 2022-2028

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