According to a new report, published by KBV research, The Global Potting Compound Market size is expected to reach $4.4 billion by 2030, rising at a market growth of 4.1% CAGR during the forecast period. In the year 2022, the market attained a volume of 914.21 kilo tonnes, experiencing a growth of 3.4% (2019-2022).
The Electrical segment is leading the Global Potting Compound Market by Application in 2022; thereby, achieving a market value of $2.3 billion by 2030. The electrical segment encompasses a diverse range of applications with unique requirements for encapsulation solutions. Potting compounds offer versatility and customization options, allowing manufacturers to tailor the properties of the potting material to meet specific application needs. Different formulations, cure times, viscosities, and colors are available to optimize performance and address unique challenges in various electrical applications.
The Thermal Curing segment is registering a CAGR of 4.3% during (2023 - 2030). Thermal curing potting compounds offer a robust and reliable cure process, ensuring complete polymerization and cross-linking of the resin system. Unlike other curing methods that may require specific environmental conditions or precise control over curing parameters, thermal curing provides a consistent and thorough cure, resulting in durable and long-lasting encapsulation of electronic components.
The Electronics segment dominated the Global Potting Compound Market by End User in 2022; thereby, achieving a market value of $1.9 billion by 2030. Potting compounds primarily encapsulate and protect electronic components from environmental factors like moisture, dust, chemicals, and mechanical shock. This protection is crucial for ensuring the reliability and longevity of electronic devices, particularly in harsh operating environments such as automotive, aerospace, industrial, and outdoor applications.
The Epoxy segment would showcase a CAGR of 3.7% during (2023 - 2030). Epoxy-based potting compounds have high thermal stability and resistance to temperature extremes. They can withstand elevated temperatures without degrading or losing their protective properties, making them suitable for high-temperature applications such as automotive under-the-hood electronics, power electronics, and industrial equipment.
Full Report: https://www.kbvresearch.com/potting-compound-market/
The Asia Pacific region is leading the Global Potting Compound Market by region in 2022, and would continue to be a dominant market till 2030; thereby, achieving a market value of $1.9 billion by 2030. The North America region is experiencing a CAGR of 3.7% during (2023 - 2030). Additionally, The Europe region would exhibit a CAGR of 3.9% during (2023 - 2030).
By Application (Volume, Kilo Tonnes, USD Billion, 2019-2030)
By Curing Technology
By End User (Volume, Kilo Tonnes, USD Billion, 2019-2030)
By Resin Type (Volume, Kilo Tonnes, USD Billion, 2019-2030)
By Geography (Volume, Kilo Tonnes, USD Billion, 2019-2030)
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