Published Date: 24-Nov-2022
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According to a new report, published by KBV research, The Global High-k And CVD ALD Metal Precursors Market size is expected to reach $740.0 Million by 2028, rising at a market growth of 6.3% CAGR during the forecast period.
The Interconnect segment acquired maximum revenue share in the Global High-k And CVD ALD Metal Precursors Market by Technology in 2021 thereby, achieving a market value of $344.1 million by 2028. The high growth of the segment is significantly attributed to the increased efficiency of this technology. Interconnect is a method of construction that uses Copper or Aluminum for patterning metals and adding barrier metal layers to shield Silicon (Si) in an Integrated Circuit from potential damage (IC).
The Asia Pacific market dominated the Global High-k And CVD ALD Metal Precursors Market by Region in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $279.1 million by 2028. The Europe market is exhibiting a CAGR of 5.8% during (2022 - 2028). Additionally, The North America market would showcase a CAGR of 5.7% during (2022 - 2028).
The market research report has exhaustive quantitative insights providing a clear picture of the market potential in various segments across the globe with country wise analysis in each discussed region. The key impacting factors of the market have been discussed in the report with the elaborated company profiles of Air Liquide S.A, Air Product & Chemicals, Inc., The Dow Chemical Company, Linde PLC, Merck KGAA, Samsung Electronics Co., Ltd., Nanmat Technology Co. Ltd., Adeka Corporation, Strem Chemicals, Inc., and Colnatec.
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