According to a new report, published by KBV research, The Global 3D stacking Market size is expected to reach $4.3 billion by 2030, rising at a market growth of 19.8% CAGR during the forecast period.
The 3D TSV (Through-Silicon Via) segment is registering maximum revenue in the Global 3D Stacking Market by Interconnecting Technology in 2022; thereby, achieving a market value of $1.9 billion by 2030. The growth of the 3D TSV segment is a significant driver for the 3D stacking market, as it enables higher integration densities, improved performance, and energy efficiency across various applications. 3D TSV technology contributes to miniaturization by allowing multiple functions to be packed into a smaller space.
The Die-to-Die segment would exhibit a CAGR of 20.7% during (2023 - 2030). Die-to-die (D2D) bonding is often used for heterogeneous integration, where different semiconductor dies are stacked together in a single package. This allows combining various functionalities, such as logic, memory, sensors, and communication components, to create more compact and versatile electronic devices. D2D bonding enables shorter interconnects between dies, reducing signal propagation delays. It also helps in maintaining signal integrity because the shorter interconnections reduce the risk of signal degradation or noise.
The Memory Devices segment is generating highest revenue in the Global 3D Stacking Market by Device Type in 2022; thereby, achieving a market value of $1.3 billion by 2030. The rise of high-performance computing applications, such as artificial intelligence (AI), machine learning, and scientific simulations, has created a substantial demand for high-speed and high-capacity memory devices. 3D stacking allows for integrating multiple memory layers, improving data access speeds for HPC systems.
The Manufacturing segment is experiencing a CAGR of 22.2% during (2023 - 2030). In many manufacturing processes, heat management is crucial. 3D stacking can improve thermal performance by enabling better heat dissipation. Heat-generating components can be strategically placed in the stack, reducing the overall temperature and potentially extending the lifespan of electronic components. With 3D stacking, manufacturers can integrate specialized components or modules to enhance product performance.
The Asia Pacific region dominated the Global 3D Stacking Market by Region in 2022, and would continue to be a dominant market till 2030; thereby, achieving a market value of $2.3 billion by 2030. The Europe region would witness a CAGR of 19.5% during (2023 - 2030). Additionally, The North America region is anticipated to grow at a CAGR of 19.2% during (2023 - 2030).
Full Report: https://www.kbvresearch.com/3d-stacking-market/
The market research report has exhaustive quantitative insights providing a clear picture of the market potential in various segments across the globe with country wise analysis in each discussed region. The key impacting factors of the market have been discussed in the report with the elaborated company profiles of Taiwan Semiconductor Manufacturing Company Limited, GLOBALFOUNDRIES Inc., Advanced Micro Devices, Inc., Qualcomm, Inc., Intel Corporation, Samsung Electronics Co., Ltd. (Samsung Group), ASE Group (ASE Technology Holding Co., Ltd.), IBM Corporation, Toshiba Corporation, and STMicroelectronics N.V.
By Interconnecting Technology
By Method
By Device Type
By End User
By Geography
Companies Profiled
Unique Offerings 
