The North America Wafer Level Packaging Market would witness market growth of 16.7% CAGR during the forecast period (2022-2028).
Wafer-Level Packaging, also known as WLCSP (Wafer-Level Chip Scale Packaging), is the smallest packaging technology currently available and is provided by OSAT, or Outsourced Semiconductor Assembly and Test, firms such as ASE, Amkor, and others. A real WLP package, on the other hand, is made up of a wafer plus an RDL (Redistribution Layer), interposer, or I/O pitch, all of which function to reorganize the die's pins/contacts such that they are spaced apart and large enough for better and easier handling. Servers, image sensors, high-end supercomputing, gaming consoles, artificial intelligence, as well as IoT (Internet of Things) devices all leverage this innovative technology. Because the WLP approach has not been defined by the industry, there is a range of options to examine. The choice is made based on how much emphasis device manufacturers place on dependability, cost, power consumption, performance, and even form factor.
There are four industries viz. semiconductors, photovoltaic goods, advanced batteries, and pharmaceuticals, that are strategically important to the United States. Integrated circuits are the fundamental components of all electronic products, enabling incredible improvements in information technology that boost productivity across all the regional industries. American supremacy in semiconductors is also critical to technological advancements in the defense sector. photovoltaic cells are the underlying technology of the Solar power and also a vital source of renewable power that can help America's national interests by reducing petroleum dependence and lowering greenhouse gas emissions. Hybrid and electric vehicles rely on advanced batteries and associated electrical management systems in the same way that conventional gasoline-powered vehicles rely on internal combustion engines. As a result, a robust local battery business is considered critical to the regional automotive industry's future competitiveness. Energy-storage devices that are light, long-lasting, and rechargeable are also needed for modern weapons systems being developed by the US military, as well as for conserving renewable energy for utility power grids.
The US market dominated the North America Wafer Level Packaging Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $2,838.6 million by 2028. The Canada market is experiencing a CAGR of 19.4% during (2022 - 2028). Additionally, The Mexico market would display a CAGR of 18.3% during (2022 - 2028).
Based on End User, the market is segmented into Consumer Electronics, Automotive, Healthcare, IT & Telecommunication, and Others. Based on Type, the market is segmented into WLCSP, 2.5D TSV WLP, 3D TSV WLP, Nano WLP, and Others. Based on Technology, the market is segmented into Fan IN and Fan OUT. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
Free Valuable Insights: The Global Wafer Level Packaging Market is Estimated to reach $14.1 Billion by 2028, at a CAGR of 17.7%
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include ASML Holding N.V., Fujitsu Limited, Toshiba Corporation, Qualcomm, Inc., Amkor Technology, Inc., Deca Technologies, Inc., Jiangsu Changjing Electronics Technology Co., Ltd., Tokyo Electron Ltd., Applied Materials, Inc., and Lam Research Corporation.
Scope of the Study
Market Segments Covered in the Report:
By End User
- Consumer Electronics
- Automotive
- Healthcare
- IT & Telecommunication
- Others
ByType
- WLCSP
- 5D TSV WLP
- 3D TSV WLP
- Nano WLP
- Others
By Technology
By Country
- US
- Canada
- Mexico
- Rest of North America
Key Market Players
List of Companies Profiled in the Report:
- ASML Holding N.V.
- Fujitsu Limited
- Toshiba Corporation
- Qualcomm, Inc.
- Amkor Technology, Inc.
- Deca Technologies, Inc.
- Jiangsu Changjing Electronics Technology Co., Ltd.
- Tokyo Electron Ltd.
- Applied Materials, Inc.
- Lam Research Corporation
Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 North America Wafer Level Packaging Market, by End User
1.4.2 North America Wafer Level Packaging Market, by Type
1.4.3 North America Wafer Level Packaging Market, by Technology
1.4.4 North America Wafer Level Packaging Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. North America Wafer Level Packaging Market by End User
3.1 North America Consumer Electronics Market by Country
3.2 North America Automotive Market by Country
3.3 North America Healthcare Market by Country
3.4 North America IT & Telecommunication Market by Country
3.5 North America Others Market by Country
Chapter 4. North America Wafer Level Packaging Market by Type
4.1 North America WLCSP Market by Country
4.2 North America 2.5D TSV WLP Market by Country
4.3 North America 3D TSV WLP Market by Country
4.4 North America Nano WLP Market by Country
4.5 North America Others Market by Country
Chapter 5. North America Wafer Level Packaging Market by Technology
5.1 North America Fan IN Market by Country
5.2 North America Fan OUT Market by Country
Chapter 6. North America Wafer Level Packaging Market by Country
6.1 US Wafer Level Packaging Market
6.1.1 US Wafer Level Packaging Market by End User
6.1.2 US Wafer Level Packaging Market by Type
6.1.3 US Wafer Level Packaging Market by Technology
6.2 Canada Wafer Level Packaging Market
6.2.1 Canada Wafer Level Packaging Market by End User
6.2.2 Canada Wafer Level Packaging Market by Type
6.2.3 Canada Wafer Level Packaging Market by Technology
6.3 Mexico Wafer Level Packaging Market
6.3.1 Mexico Wafer Level Packaging Market by End User
6.3.2 Mexico Wafer Level Packaging Market by Type
6.3.3 Mexico Wafer Level Packaging Market by Technology
6.4 Rest of North America Wafer Level Packaging Market
6.4.1 Rest of North America Wafer Level Packaging Market by End User
6.4.2 Rest of North America Wafer Level Packaging Market by Type
6.4.3 Rest of North America Wafer Level Packaging Market by Technology
Chapter 7. Company Profiles
7.1 ASML Holding N.V.
7.1.1 Company Overview
7.1.2 Financial Analysis
7.1.3 Regional Analysis
7.1.4 Research & Development Expenses
7.2 Fujitsu Limited
7.2.1 Company Overview
7.2.2 Financial Analysis
7.2.3 Segmental Analysis
7.2.4 SWOT Analysis
7.3 Toshiba Corporation
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Segmental and Regional Analysis
7.3.4 Research and Development Expense
7.4 Qualcomm, Inc.
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Segmental and Regional Analysis
7.4.4 Research & Development Expense
7.5 Amkor Technology, Inc.
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 Regional Analysis
7.5.4 Research & Development Expense
7.6 Deca Technologies, Inc.
7.6.1 Company Overview
7.6.2 Recent strategies and developments:
7.6.2.1 Partnerships, Collaborations, and Agreements:
7.6.2.2 Product Launches and Product Expansions:
7.7 Jiangsu Changjing Electronics Technology Co., Ltd.
7.7.1 Company Overview
7.8 Tokyo Electron Ltd.
7.8.1 Company Overview
7.8.2 Financial Analysis
7.8.3 Segmental and Regional Analysis
7.8.4 Research & Development Expenses
7.9 Applied Materials, Inc.
7.9.1 Company Overview
7.9.2 Financial Analysis
7.9.3 Segmental and Regional Analysis
7.9.4 Research & Development Expenses
7.10. Lam Research Corporation
7.10.1 Company Overview
7.10.2 Financial Analysis
7.10.3 Regional Analysis
7.10.4 Research & Development Expenses
TABLE 1 North America Wafer Level Packaging Market, 2018 - 2021, USD Million
TABLE 2 North America Wafer Level Packaging Market, 2022 - 2028, USD Million
TABLE 3 North America Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
TABLE 4 North America Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
TABLE 5 North America Consumer Electronics Market by Country, 2018 - 2021, USD Million
TABLE 6 North America Consumer Electronics Market by Country, 2022 - 2028, USD Million
TABLE 7 North America Automotive Market by Country, 2018 - 2021, USD Million
TABLE 8 North America Automotive Market by Country, 2022 - 2028, USD Million
TABLE 9 North America Healthcare Market by Country, 2018 - 2021, USD Million
TABLE 10 North America Healthcare Market by Country, 2022 - 2028, USD Million
TABLE 11 North America IT & Telecommunication Market by Country, 2018 - 2021, USD Million
TABLE 12 North America IT & Telecommunication Market by Country, 2022 - 2028, USD Million
TABLE 13 North America Others Market by Country, 2018 - 2021, USD Million
TABLE 14 North America Others Market by Country, 2022 - 2028, USD Million
TABLE 15 North America Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
TABLE 16 North America Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
TABLE 17 North America WLCSP Market by Country, 2018 - 2021, USD Million
TABLE 18 North America WLCSP Market by Country, 2022 - 2028, USD Million
TABLE 19 North America 2.5D TSV WLP Market by Country, 2018 - 2021, USD Million
TABLE 20 North America 2.5D TSV WLP Market by Country, 2022 - 2028, USD Million
TABLE 21 North America 3D TSV WLP Market by Country, 2018 - 2021, USD Million
TABLE 22 North America 3D TSV WLP Market by Country, 2022 - 2028, USD Million
TABLE 23 North America Nano WLP Market by Country, 2018 - 2021, USD Million
TABLE 24 North America Nano WLP Market by Country, 2022 - 2028, USD Million
TABLE 25 North America Others Market by Country, 2018 - 2021, USD Million
TABLE 26 North America Others Market by Country, 2022 - 2028, USD Million
TABLE 27 North America Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
TABLE 28 North America Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
TABLE 29 North America Fan IN Market by Country, 2018 - 2021, USD Million
TABLE 30 North America Fan IN Market by Country, 2022 - 2028, USD Million
TABLE 31 North America Fan OUT Market by Country, 2018 - 2021, USD Million
TABLE 32 North America Fan OUT Market by Country, 2022 - 2028, USD Million
TABLE 33 North America Wafer Level Packaging Market by Country, 2018 - 2021, USD Million
TABLE 34 North America Wafer Level Packaging Market by Country, 2022 - 2028, USD Million
TABLE 35 US Wafer Level Packaging Market, 2018 - 2021, USD Million
TABLE 36 US Wafer Level Packaging Market, 2022 - 2028, USD Million
TABLE 37 US Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
TABLE 38 US Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
TABLE 39 US Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
TABLE 40 US Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
TABLE 41 US Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
TABLE 42 US Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
TABLE 43 Canada Wafer Level Packaging Market, 2018 - 2021, USD Million
TABLE 44 Canada Wafer Level Packaging Market, 2022 - 2028, USD Million
TABLE 45 Canada Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
TABLE 46 Canada Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
TABLE 47 Canada Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
TABLE 48 Canada Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
TABLE 49 Canada Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
TABLE 50 Canada Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
TABLE 51 Mexico Wafer Level Packaging Market, 2018 - 2021, USD Million
TABLE 52 Mexico Wafer Level Packaging Market, 2022 - 2028, USD Million
TABLE 53 Mexico Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
TABLE 54 Mexico Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
TABLE 55 Mexico Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
TABLE 56 Mexico Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
TABLE 57 Mexico Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
TABLE 58 Mexico Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
TABLE 59 Rest of North America Wafer Level Packaging Market, 2018 - 2021, USD Million
TABLE 60 Rest of North America Wafer Level Packaging Market, 2022 - 2028, USD Million
TABLE 61 Rest of North America Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
TABLE 62 Rest of North America Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
TABLE 63 Rest of North America Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
TABLE 64 Rest of North America Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
TABLE 65 Rest of North America Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
TABLE 66 Rest of North America Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
TABLE 67 Key information – ASML Holding N.V.
TABLE 68 Key Information – Fujitsu Limited
TABLE 69 Key Information – Toshiba Corporation
TABLE 70 Key Information – Qualcomm, Inc.
TABLE 71 Key Information – Amkor Technology, Inc.
TABLE 72 Key Information – Deca Technologies, Inc.
TABLE 73 Key Information – Jiangsu Changjing Electronics Technology Co., Ltd.
TABLE 74 Key Information – Tokyo Electron Ltd.
TABLE 75 Key Information – Applied Materials, Inc.
TABLE 76 Key Information – Lam Research Corporation
List of Figures
FIG 1 Methodology for the research
FIG 2 SWOT Analysis: Fujitsu Limited