Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 North America Advanced IC Substrates Market, by Type
1.4.2 North America Advanced IC Substrates Market, by Technology
1.4.3 North America Advanced IC Substrates Market, by Application
1.4.4 North America Advanced IC Substrates Market, by Country
1.5 Methodology for the research
Chapter 2. Market at a Glance
2.1 Key Highlights
Chapter 3. Market Overview
3.1 Introduction
3.1.1 Market Overview
3.1.1.1 Market Composition and Scenario
3.2 Key impacting the Market
3.2.1 Market Drivers
3.2.2 Market Restraints
3.2.3 Market Opportunities
3.2.4 Market Challenges
Chapter 4. Market Trends – North America Advanced IC substrates market
Chapter 5. State of Competition – North America Advanced IC substrates market
Chapter 6. Value Chain Analysis of Advanced IC Substrates Market
Chapter 7. Product Life Cycle – Advanced IC substrates market
Chapter 8. Market Consolidation – Advanced IC Substrates Market
Chapter 9. Competition Analysis – Global
9.1 Market Share Analysis, 2024
9.2 Recent Strategies Deployed in Advanced IC Substrates Market
9.3 Porter Five Forces Analysis
Chapter 10. Key Customer Criteria – Advanced IC substrates market
Chapter 11. North America Advanced IC Substrates Market by Type
11.1 North America Flip Chip Ball Grid Array (FCBGA) Substrates Market by Region
11.2 North America Wire Bond Substrates Market by Region
11.3 North America Flip Chip Chip Scale Package (FCCSP) Substrates Market by Region
11.4 North America Embedded Substrates Market by Region
11.5 North America Other Type Market by Region
Chapter 12. North America Advanced IC Substrates Market by Technology
12.1 North America High-Density Interconnect (HDI) Substrates Market by Country
12.2 North America Build-Up Substrates Market by Country
12.3 North America Ceramic Substrates Market by Country
12.4 North America Coreless Substrates Market by Country
12.5 North America Other Technology Market by Country
Chapter 13. North America Advanced IC Substrates Market by Application
13.1 North America Mobile & Consumer Electronics Market by Country
13.2 North America Networking & Communication Devices Market by Country
13.3 North America Automotive Electronics Market by Country
13.4 North America Computing and Data Centers Market by Country
13.5 North America Other Application Market by Country
Chapter 14. North America Advanced IC Substrates Market by Country
14.1 US Advanced IC Substrates Market
14.1.1 US Advanced IC Substrates Market by Type
14.1.2 US Advanced IC Substrates Market by Technology
14.1.3 US Advanced IC Substrates Market by Application
14.2 Canada Advanced IC Substrates Market
14.2.1 Canada Advanced IC Substrates Market by Type
14.2.2 Canada Advanced IC Substrates Market by Technology
14.2.3 Canada Advanced IC Substrates Market by Application
14.3 Mexico Advanced IC Substrates Market
14.3.1 Mexico Advanced IC Substrates Market by Type
14.3.2 Mexico Advanced IC Substrates Market by Technology
14.3.3 Mexico Advanced IC Substrates Market by Application
14.4 Rest of North America Advanced IC Substrates Market
14.4.1 Rest of North America Advanced IC Substrates Market by Type
14.4.2 Rest of North America Advanced IC Substrates Market by Technology
14.4.3 Rest of North America Advanced IC Substrates Market by Application
Chapter 15. Company Profiles
15.1 UNIMICRON TECHNOLOGY CORP.
15.1.1 Company Overview
15.1.2 Financial Analysis
15.1.3 Segmental and Regional Analysis
15.1.4 Research & Development Expenses
15.1.5 SWOT Analysis
15.2 Zhen Ding Technology Holding Limited
15.2.1 Company Overview
15.2.2 Financial Analysis
15.2.3 Regional Analysis
15.2.4 Recent strategies and developments:
15.2.4.1 Partnerships, Collaborations, and Agreements:
15.2.5 SWOT Analysis
15.3 Nan Ya Plastics Corp. (NPC)
15.3.1 Company Overview
15.3.2 Financial Analysis
15.3.3 SWOT Analysis
15.4 ASE Group (ASE Technology Holding Co., Ltd.)
15.4.1 Company Overview
15.4.2 Financial Analysis
15.4.3 Segmental and Regional Analysis
15.4.4 Research & Development Expenses
15.4.5 Recent strategies and developments:
15.4.5.1 Partnerships, Collaborations, and Agreements:
15.4.6 SWOT Analysis
15.5 AT&S Group
15.5.1 Company Overview
15.5.2 Financial Analysis
15.5.3 Segmental and Regional Analysis
15.5.4 Research & Development Expenses
15.5.5 Recent strategies and developments:
15.5.5.1 Partnerships, Collaborations, and Agreements:
15.6 Samsung Electronics Co., Ltd. (Samsung Group)
15.6.1 Company Overview
15.6.2 Financial Analysis
15.6.3 Segmental and Regional Analysis
15.6.4 Research & Development Expenses
15.6.5 Recent strategies and developments:
15.6.5.1 Partnerships, Collaborations, and Agreements:
15.6.6 SWOT Analysis
15.7 Ibiden Co., Ltd.
15.7.1 Company Overview
15.7.2 Financial Analysis
15.7.3 Segmental Analysis
15.7.4 SWOT Analysis
15.8 Kyocera Corporation
15.8.1 Company Overview
15.8.2 Financial Analysis
15.8.3 Segmental and Regional Analysis
15.8.4 Research & Development Expenses
15.8.5 SWOT Analysis
15.9 TTM Technologies, Inc.
15.9.1 Company Overview
15.9.2 Financial Analysis
15.9.3 Segmental and Regional Analysis
15.9.4 Research & Development Expenses
15.9.5 SWOT Analysis
15.10. LG Innotek Co Ltd. (LG Display Co., Ltd.)
15.10.1 Company Overview
15.10.2 Financial Analysis
15.10.3 Regional Analysis
15.10.4 Research & Development Expenses
15.10.5 Recent strategies and developments:
15.10.5.1 Geographical Expansions:
15.10.6 SWOT Analysis