According to a new report North America Flip Chip Market, published by KBV research, the North America Flip Chip Market would witness market growth of 7.5% CAGR during the forecast period (2020-2026).
The US market dominated the North America Gold Bumping Flip Chip Market by Country 2019, and would continue to be a dominant market till 2026. The Canada market is experiencing a CAGR of 9.2% during (2020 - 2026). Additionally, The Mexico market would witness a CAGR of 8.2% during (2020 - 2026).
The 2.5D IC market dominated the Canada Flip Chip Market by Packaging Technology 2019, thereby, achieving a market value of $633.1 million by 2026. The 2D IC market is expected to witness a CAGR of 10.4% during (2020 - 2026).
The Electronics market dominated the Mexico Flip Chip Market by End User 2019, growing at a CAGR of 7.1 % during the forecast period. The Industrial market is exhibiting a CAGR of 9.4% during (2020 - 2026). The IT & Telecom market is estimated to grow at a CAGR of 8.3% during (2020 - 2026). Additionally, The Automotive market would showcase CAGR of 10.7% during (2020 - 2026).
Report Structural Insights: https://www.kbvresearch.com/north-america-flip-chip-market/
The market research report has exhaustive quantitative insights providing a clear picture of the market potential in various segments across the mentioned countries. The key impacting factors of the market have been discussed in the report with the elaborated company profiles of 3M Company, Advanced Micro Devices, Inc., Amkor Technology, Inc., Apple, Inc., Fujitsu Limited, Intel Corporation, IBM Corporation, Samsung Electronics Co., Ltd., Texas Instruments, Inc., and Taiwan Semiconductor Manufacturing Company.
By Packaging Technology
By Bumping Technology
By End-User
By Country
Companies Profiled
Unique Offerings from KBV Research
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