According to a new report LAMEA Flip Chip Market, published by KBV research, the LAMEA Flip Chip Market would witness market growth of 10.2% CAGR during the forecast period (2020-2026).
The Brazil market dominated the LAMEA Flip Chip 2D IC Market by Country 2019, thereby, achieving a market value of $102.9 million by 2026. The Argentina market would witness a CAGR of 11.4% during (2020 - 2026). Additionally, The UAE market is experiencing a CAGR of 10.5% during (2020 - 2026).
The Copper Pillar market dominated the Saudi Arabia Flip Chip Market by Bumping Technology 2019, growing at a CAGR of 9.4 % during the forecast period. The Gold Bumping market is exhibiting a CAGR of 10% during (2020 - 2026). Additionally, The Solder Bumping market is estimated to grow at a CAGR of 11.3% during (2020 - 2026).
The Electronics market dominated the South Africa Flip Chip Market by End User 2019, growing at a CAGR of 9.1 % during the forecast period. The Industrial market is experiencing a CAGR of 11.5% during (2020 - 2026). The IT & Telecom market is witnessing a CAGR of 10.3% during (2020 - 2026). Additionally, The Automotive market would showcase a CAGR of 12.8% during (2020 - 2026).
Structural Insights: https://www.kbvresearch.com/lamea-flip-chip-market/
The market research report has exhaustive quantitative insights providing a clear picture of the market potential in various segments across the mentioned countries. The key impacting factors of the market have been discussed in the report with the elaborated company profiles of 3M Company, Advanced Micro Devices, Inc., Amkor Technology, Inc., Apple, Inc., Fujitsu Limited, Intel Corporation, IBM Corporation, Samsung Electronics Co., Ltd., Texas Instruments, Inc., and Taiwan Semiconductor Manufacturing Company.
By Packaging Technology
By Bumping Technology
By End-User
By Country
Companies Profiled
Unique Offerings from KBV Research
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