According to a new report Asia Pacific Flip Chip Market, published by KBV research, the Asia Pacific Flip Chip Market would witness market growth of 8.6% CAGR during the forecast period (2020-2026).
The China market dominated the Asia Pacific IT & Telecom Flip Chip Market by Country 2019, and would continue to be a dominant market till 2026. The Japan market is experiencing a CAGR of 7.2% during (2020 - 2026). Additionally, The India market is poised to grow at a CAGR of 8.4% during (2020 - 2026).
The 2.5D IC market dominated the South Korea Flip Chip Market by Packaging Technology 2019, growing at a CAGR of 9.7 % during the forecast period. The 2D IC market is expected to witness a CAGR of 10.3% during (2020 - 2026).
The Copper Pillar market dominated the Malaysia Flip Chip Market by Bumping Technology 2019, thereby, achieving a market value of $385.1 million by 2026. The Gold Bumping market is exhibiting a CAGR of 11.3% during (2020 - 2026). Additionally, The Solder Bumping market is estimated to grow at a CAGR of 12.9% during (2020 - 2026).
Structural Insights: https://www.kbvresearch.com/asia-pacific-flip-chip-market/
The market research report has exhaustive quantitative insights providing a clear picture of the market potential in various segments across the mentioned countries. The key impacting factors of the market have been discussed in the report with the elaborated company profiles of 3M Company, Advanced Micro Devices, Inc., Amkor Technology, Inc., Apple, Inc., Fujitsu Limited, Intel Corporation, IBM Corporation, Samsung Electronics Co., Ltd., Texas Instruments, Inc., and Taiwan Semiconductor Manufacturing Company.
By Packaging Technology
By Bumping Technology
By End-User
By Country
Companies Profiled
Unique Offerings from KBV Research
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