The Latin America, Middle East and Africa Wafer Level Packaging Market would witness market growth of 21.6% CAGR during the forecast period (2022-2028).
One of the most important applications for WLP was still to come, as I/O requirements grew, necessitating ever-higher connection density. The RDL, or Redistribution Layer, was born as a result of this, and it reroutes chip connections via conductive metal traces. RDL is also useful since it allows WLP packaging to incorporate multiple chips with distinct functionalities, resulting in the SiP, or System in Package. These encapsulated systems are commonly employed in the mobile device market because they can be manufactured very small to fit space constraints and because they bundle all of the required functionality into an individual structure.
Wafer level fan-out, a low-density technology that promises to reduce fan-out costs, is being implemented by a number of packaging companies. FOPLP is projected to be critical for future 5G, AI, Biotech, smart city, Advanced Driver Assistance System (ADAS), and IoT applications. Major criteria include the ability to offer innovative testing and packing services as well as secure customer relationships. Wafer level packaging technology is in high demand across a variety of industries, including consumer electronics, aerospace and defense, automotive, telecommunications, and others, due to its smaller form factor and improved thermal performance.
The increased popularity of advanced and high-end technology-based items, along with reduced electronics prices, has resulted in a spike in consumer electronics demand. Additionally, technological innovations, such as the Internet of Things, or IoT as well as Long-Term Evolution (LTE), are supporting the consumption of electronic goods in the region, which will help the region's semiconductor market to strengthen in the next years. Moreover, increased utilization of smartphones, televisions, and laptops in Brazil and Mexico would benefit the Latin American market. Consumers in this region are spending on high-end electronic equipment as their disposable income levels continue to rise.
The availability of skilled labor resources, as well as substantial technological breakthroughs, would propel the wafer level packaging market in the Middle East and Africa to new heights during the coming years. Furthermore, innovative industrial electronics, as well as high-end computing technologies, are in high demand throughout the region, due to which, the demand for semiconductors is estimated to surge in the region. This factor would benefit the demand for wafer packaging solutions and the growth of the wafer level packaging market would be propelled.
The Brazil market dominated the LAMEA Wafer Level Packaging Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $243.7 million by 2028. The Argentina market is estimated to grow at a CAGR of 22.3% during (2022 - 2028). Additionally, The UAE market would display a CAGR of 21.3% during (2022 - 2028).
Based on End User, the market is segmented into Consumer Electronics, Automotive, Healthcare, IT & Telecommunication, and Others. Based on Type, the market is segmented into WLCSP, 2.5D TSV WLP, 3D TSV WLP, Nano WLP, and Others. Based on Technology, the market is segmented into Fan IN and Fan OUT. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.
Free Valuable Insights: The Global Wafer Level Packaging Market is Predict to reach $14.1 Billion by 2028, at a CAGR of 17.7%
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include ASML Holding N.V., Fujitsu Limited, Toshiba Corporation, Qualcomm, Inc., Amkor Technology, Inc., Deca Technologies, Inc., Jiangsu Changjing Electronics Technology Co., Ltd., Tokyo Electron Ltd., Applied Materials, Inc., and Lam Research Corporation.
Scope of the Study
Market Segments Covered in the Report:
By End User
- Consumer Electronics
- Automotive
- Healthcare
- IT & Telecommunication
- Others
ByType
- WLCSP
- 5D TSV WLP
- 3D TSV WLP
- Nano WLP
- Others
By Technology
By Country
- Brazil
- Argentina
- UAE
- Saudi Arabia
- South Africa
- Nigeria
- Rest of LAMEA
Key Market Players
List of Companies Profiled in the Report:
- ASML Holding N.V.
- Fujitsu Limited
- Toshiba Corporation
- Qualcomm, Inc.
- Amkor Technology, Inc.
- Deca Technologies, Inc.
- Jiangsu Changjing Electronics Technology Co., Ltd.
- Tokyo Electron Ltd.
- Applied Materials, Inc.
- Lam Research Corporation
Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 LAMEA Wafer Level Packaging Market, by End User
1.4.2 LAMEA Wafer Level Packaging Market, by Type
1.4.3 LAMEA Wafer Level Packaging Market, by Technology
1.4.4 LAMEA Wafer Level Packaging Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. LAMEA Wafer Level Packaging Market by End User
3.1 LAMEA Consumer Electronics Market by Country
3.2 LAMEA Automotive Market by Country
3.3 LAMEA Healthcare Market by Country
3.4 LAMEA IT & Telecommunication Market by Country
3.5 LAMEA Others Market by Country
Chapter 4. LAMEA Wafer Level Packaging Market by Type
4.1 LAMEA WLCSP Market by Country
4.2 LAMEA 2.5D TSV WLP Market by Country
4.3 LAMEA 3D TSV WLP Market by Country
4.4 LAMEA Nano WLP Market by Country
4.5 LAMEA Others Market by Country
Chapter 5. LAMEA Wafer Level Packaging Market by Technology
5.1 LAMEA Fan IN Market by Country
5.2 LAMEA Fan OUT Market by Country
Chapter 6. LAMEA Wafer Level Packaging Market by Country
6.1 Brazil Wafer Level Packaging Market
6.1.1 Brazil Wafer Level Packaging Market by End User
6.1.2 Brazil Wafer Level Packaging Market by Type
6.1.3 Brazil Wafer Level Packaging Market by Technology
6.2 Argentina Wafer Level Packaging Market
6.2.1 Argentina Wafer Level Packaging Market by End User
6.2.2 Argentina Wafer Level Packaging Market by Type
6.2.3 Argentina Wafer Level Packaging Market by Technology
6.3 UAE Wafer Level Packaging Market
6.3.1 UAE Wafer Level Packaging Market by End User
6.3.2 UAE Wafer Level Packaging Market by Type
6.3.3 UAE Wafer Level Packaging Market by Technology
6.4 Saudi Arabia Wafer Level Packaging Market
6.4.1 Saudi Arabia Wafer Level Packaging Market by End User
6.4.2 Saudi Arabia Wafer Level Packaging Market by Type
6.4.3 Saudi Arabia Wafer Level Packaging Market by Technology
6.5 South Africa Wafer Level Packaging Market
6.5.1 South Africa Wafer Level Packaging Market by End User
6.5.2 South Africa Wafer Level Packaging Market by Type
6.5.3 South Africa Wafer Level Packaging Market by Technology
6.6 Nigeria Wafer Level Packaging Market
6.6.1 Nigeria Wafer Level Packaging Market by End User
6.6.2 Nigeria Wafer Level Packaging Market by Type
6.6.3 Nigeria Wafer Level Packaging Market by Technology
6.7 Rest of LAMEA Wafer Level Packaging Market
6.7.1 Rest of LAMEA Wafer Level Packaging Market by End User
6.7.2 Rest of LAMEA Wafer Level Packaging Market by Type
6.7.3 Rest of LAMEA Wafer Level Packaging Market by Technology
Chapter 7. Company Profiles
7.1 ASML Holding N.V.
7.1.1 Company Overview
7.1.2 Financial Analysis
7.1.3 Regional Analysis
7.1.4 Research & Development Expenses
7.2 Fujitsu Limited
7.2.1 Company Overview
7.2.2 Financial Analysis
7.2.3 Segmental Analysis
7.2.4 SWOT Analysis
7.3 Toshiba Corporation
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Segmental and Regional Analysis
7.3.4 Research and Development Expense
7.4 Qualcomm, Inc.
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Segmental and Regional Analysis
7.4.4 Research & Development Expense
7.5 Amkor Technology, Inc.
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 Regional Analysis
7.5.4 Research & Development Expense
7.6 Deca Technologies, Inc.
7.6.1 Company Overview
7.6.2 Recent strategies and developments:
7.6.2.1 Partnerships, Collaborations, and Agreements:
7.6.2.2 Product Launches and Product Expansions:
7.7 Jiangsu Changjing Electronics Technology Co., Ltd.
7.7.1 Company Overview
7.8 Tokyo Electron Ltd.
7.8.1 Company Overview
7.8.2 Financial Analysis
7.8.3 Segmental and Regional Analysis
7.8.4 Research & Development Expenses
7.9 Applied Materials, Inc.
7.9.1 Company Overview
7.9.2 Financial Analysis
7.9.3 Segmental and Regional Analysis
7.9.4 Research & Development Expenses
7.10. Lam Research Corporation
7.10.1 Company Overview
7.10.2 Financial Analysis
7.10.3 Regional Analysis
7.10.4 Research & Development Expenses
TABLE 1 LAMEA Wafer Level Packaging Market, 2018 - 2021, USD Million
TABLE 2 LAMEA Wafer Level Packaging Market, 2022 - 2028, USD Million
TABLE 3 LAMEA Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
TABLE 4 LAMEA Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
TABLE 5 LAMEA Consumer Electronics Market by Country, 2018 - 2021, USD Million
TABLE 6 LAMEA Consumer Electronics Market by Country, 2022 - 2028, USD Million
TABLE 7 LAMEA Automotive Market by Country, 2018 - 2021, USD Million
TABLE 8 LAMEA Automotive Market by Country, 2022 - 2028, USD Million
TABLE 9 LAMEA Healthcare Market by Country, 2018 - 2021, USD Million
TABLE 10 LAMEA Healthcare Market by Country, 2022 - 2028, USD Million
TABLE 11 LAMEA IT & Telecommunication Market by Country, 2018 - 2021, USD Million
TABLE 12 LAMEA IT & Telecommunication Market by Country, 2022 - 2028, USD Million
TABLE 13 LAMEA Others Market by Country, 2018 - 2021, USD Million
TABLE 14 LAMEA Others Market by Country, 2022 - 2028, USD Million
TABLE 15 LAMEA Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
TABLE 16 LAMEA Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
TABLE 17 LAMEA WLCSP Market by Country, 2018 - 2021, USD Million
TABLE 18 LAMEA WLCSP Market by Country, 2022 - 2028, USD Million
TABLE 19 LAMEA 2.5D TSV WLP Market by Country, 2018 - 2021, USD Million
TABLE 20 LAMEA 2.5D TSV WLP Market by Country, 2022 - 2028, USD Million
TABLE 21 LAMEA 3D TSV WLP Market by Country, 2018 - 2021, USD Million
TABLE 22 LAMEA 3D TSV WLP Market by Country, 2022 - 2028, USD Million
TABLE 23 LAMEA Nano WLP Market by Country, 2018 - 2021, USD Million
TABLE 24 LAMEA Nano WLP Market by Country, 2022 - 2028, USD Million
TABLE 25 LAMEA Others Market by Country, 2018 - 2021, USD Million
TABLE 26 LAMEA Others Market by Country, 2022 - 2028, USD Million
TABLE 27 LAMEA Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
TABLE 28 LAMEA Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
TABLE 29 LAMEA Fan IN Market by Country, 2018 - 2021, USD Million
TABLE 30 LAMEA Fan IN Market by Country, 2022 - 2028, USD Million
TABLE 31 LAMEA Fan OUT Market by Country, 2018 - 2021, USD Million
TABLE 32 LAMEA Fan OUT Market by Country, 2022 - 2028, USD Million
TABLE 33 LAMEA Wafer Level Packaging Market by Country, 2018 - 2021, USD Million
TABLE 34 LAMEA Wafer Level Packaging Market by Country, 2022 - 2028, USD Million
TABLE 35 Brazil Wafer Level Packaging Market, 2018 - 2021, USD Million
TABLE 36 Brazil Wafer Level Packaging Market, 2022 - 2028, USD Million
TABLE 37 Brazil Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
TABLE 38 Brazil Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
TABLE 39 Brazil Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
TABLE 40 Brazil Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
TABLE 41 Brazil Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
TABLE 42 Brazil Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
TABLE 43 Argentina Wafer Level Packaging Market, 2018 - 2021, USD Million
TABLE 44 Argentina Wafer Level Packaging Market, 2022 - 2028, USD Million
TABLE 45 Argentina Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
TABLE 46 Argentina Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
TABLE 47 Argentina Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
TABLE 48 Argentina Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
TABLE 49 Argentina Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
TABLE 50 Argentina Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
TABLE 51 UAE Wafer Level Packaging Market, 2018 - 2021, USD Million
TABLE 52 UAE Wafer Level Packaging Market, 2022 - 2028, USD Million
TABLE 53 UAE Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
TABLE 54 UAE Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
TABLE 55 UAE Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
TABLE 56 UAE Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
TABLE 57 UAE Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
TABLE 58 UAE Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
TABLE 59 Saudi Arabia Wafer Level Packaging Market, 2018 - 2021, USD Million
TABLE 60 Saudi Arabia Wafer Level Packaging Market, 2022 - 2028, USD Million
TABLE 61 Saudi Arabia Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
TABLE 62 Saudi Arabia Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
TABLE 63 Saudi Arabia Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
TABLE 64 Saudi Arabia Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
TABLE 65 Saudi Arabia Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
TABLE 66 Saudi Arabia Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
TABLE 67 South Africa Wafer Level Packaging Market, 2018 - 2021, USD Million
TABLE 68 South Africa Wafer Level Packaging Market, 2022 - 2028, USD Million
TABLE 69 South Africa Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
TABLE 70 South Africa Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
TABLE 71 South Africa Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
TABLE 72 South Africa Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
TABLE 73 South Africa Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
TABLE 74 South Africa Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
TABLE 75 Nigeria Wafer Level Packaging Market, 2018 - 2021, USD Million
TABLE 76 Nigeria Wafer Level Packaging Market, 2022 - 2028, USD Million
TABLE 77 Nigeria Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
TABLE 78 Nigeria Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
TABLE 79 Nigeria Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
TABLE 80 Nigeria Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
TABLE 81 Nigeria Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
TABLE 82 Nigeria Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
TABLE 83 Rest of LAMEA Wafer Level Packaging Market, 2018 - 2021, USD Million
TABLE 84 Rest of LAMEA Wafer Level Packaging Market, 2022 - 2028, USD Million
TABLE 85 Rest of LAMEA Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
TABLE 86 Rest of LAMEA Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
TABLE 87 Rest of LAMEA Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
TABLE 88 Rest of LAMEA Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
TABLE 89 Rest of LAMEA Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
TABLE 90 Rest of LAMEA Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
TABLE 91 Key information – ASML Holding N.V.
TABLE 92 Key Information – Fujitsu Limited
TABLE 93 Key Information – Toshiba Corporation
TABLE 94 Key Information – Qualcomm, Inc.
TABLE 95 Key Information – Amkor Technology, Inc.
TABLE 96 Key Information – Deca Technologies, Inc.
TABLE 97 Key Information – Jiangsu Changjing Electronics Technology Co., Ltd.
TABLE 98 Key Information – Tokyo Electron Ltd.
TABLE 99 Key Information – Applied Materials, Inc.
TABLE 100 Key Information – Lam Research Corporation
List of Figures
FIG 1 Methodology for the research
FIG 2 SWOT Analysis: Fujitsu Limited