Europe Glass Interposers Market

Europe Glass Interposers Market Size, Share & Industry Analysis Report By Wafer Size, By Application (2.5D Packaging, 3D Packaging, and Fan-Out Packaging), By Substrate Technology (Through-Glass Vias (TGV), Redistribution Layer (RDL)-First/Last, and Glass Panel Level Packaging (PLP)), By End Use Industry, By Country and Growth Forecast, 2025 - 2032

Report Id: KBV-28660 Publication Date: August-2025 Number of Pages: 169 Report Format: PDF + Excel
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Analysis of Market Size & Trends

The Europe Glass Interposers Market would witness market growth of 11.5% CAGR during the forecast period (2025-2032).

The Germany market dominated the Europe Glass Interposers Market by Country in 2024, and would continue to be a dominant market till 2032; thereby, achieving a market value of $12.2 million by 2032. The UK market is exhibiting a CAGR of 10% during (2025 - 2032). Additionally, The France market would experience a CAGR of 12.4% during (2025 - 2032). The Germany and UK led the Europe Glass Interposers Market by Country with a market share of 26.3% and 12.9% in 2024.

Europe Glass Interposers Market Size, 2021 - 2032

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Europe’s adoption of glass interposers is gradually increasing, supported by its strong presence in automotive, industrial automation, and energy-efficient electronics sectors. As smart mobility and digital technologies advance, European industries are leveraging glass interposers for their precision, reliability, and suitability in safety-critical applications. This technology is becoming integral in automotive radar, LiDAR, and ADAS systems where thermal stability and dimensional accuracy are crucial for performance.

Regional efforts are focused on enhancing local substrate design and embedding these capabilities into Europe’s semiconductor value chains. Public funding and collaborative innovation projects emphasize developing sustainable, scalable packaging solutions with glass interposers at the core. Influencing factors include strict EU regulations on device reliability and emissions, the drive for zero-defect automotive electronics, and strategic priorities to bolster domestic semiconductor production as part of broader digital and green transitions.

Wafer Size Outlook

Based on Wafer Size, the market is segmented into 300 mm, 200 mm, and Less than 200 mm. Among various UK Glass Interposers Market by Wafer Size; The 300 mm market achieved a market size of USD $3.3 Million in 2024 and is expected to grow at a CAGR of 9.5 % during the forecast period. The Less than 200 mm market is predicted to experience a CAGR of 11.1% throughout the forecast period from (2025 - 2032).

Country Glass Interposers Market Size by Segmentation

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Application Outlook

Based on Application, the market is segmented into 2.5D Packaging, 3D Packaging, and Fan-Out Packaging. The 2.5D Packaging market segment dominated the Germany Glass Interposers Market by Application is expected to grow at a CAGR of 9.7 % during the forecast period thereby continuing its dominance until 2032. Also, The Fan-Out Packaging market is anticipated to grow as a CAGR of 11.3 % during the forecast period during (2025 - 2032).

Country Outlook

Germany’s glass interposers market is in an early but promising phase, driven by its leadership in automotive electronics, industrial automation, and aerospace. The focus is on upstream development with strong research institutions advancing through-glass via (TGV) technology and wafer-level packaging. Key strengths lie in precision glass suppliers and niche pilot projects for photonic, sensor, and telecom applications. Collaboration between research institutes and global firms supports innovation, despite challenges like high capital costs and competition from silicon and organic interposers. Germany is well-positioned for growth in specialized, high-value sectors such as automotive sensors and industrial packaging as global demand rises.

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List of Key Companies Profiled

  • Corning Incorporated
  • AGC Inc.
  • Schott AG (Carl-Zeiss-Stiftung)
  • Dai Nippon Printing Co., Ltd.
  • Tecnisco, LTD. (Disco Corporation)
  • Samtec, Inc.
  • RENA Technologies GmbH
  • PLANOPTIK AG
  • 3DGS Inc.
  • Workshop of Photonics

Europe Glass Interposers Market Report Segmentation

By Wafer Size

  • 300 mm
  • 200 mm
  • Less than 200 mm

By Application

  • 2.5D Packaging
  • 3D Packaging
  • Fan-Out Packaging

By Substrate Technology

  • Through-Glass Vias (TGV)
  • Redistribution Layer (RDL)-First/Last
  • Glass Panel Level Packaging (PLP)

By End Use Industry

  • Consumer Electronics
  • Telecommunications
  • Automotive
  • Defense & Aerospace
  • Healthcare
  • Other End Use Industry

By Country

  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe
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