Asia Pacific Wafer Level Packaging Market Size, Share & Industry Trends Analysis Report By End User (Consumer Electronics, Automotive, Healthcare, IT & Telecommunication), By Type, By Country and Growth Forecast, 2022 - 2028

The Asia Pacific Wafer Level Packaging Market would witness market growth of 18.4% CAGR during the forecast period (2022-2028).

The demand for wafer-level packaging is likely to propel the wafer-level packaging market in the coming years due to the increased demand for high-speed and small-size electronic goods. In addition, the market is expected to grow in the coming years due to the growing popularity of the Internet of Things and portable gadgets. Additionally, the market is likely to be fueled by the technological advantages of WLP over conventional packaging methods and the growing requirement for circuit miniaturization in microelectronic devices. Wires were used to link the chips to the substrate before the emergence of wafer level packaging, from the chip's edges to the corresponding pads/pins on the substrate, in a process known as wire-bonding.

Wafer-Level Packaging technologies have conquered one of the most important domains in the smartphone industry. Because of the stringent and ever-increasing size limits, mobile devices are the ideal application for WLP packages, which include wireless connectivity, sensors, cameras, and power management.

In terms of consumption, China is one of the largest markets for semiconductors, and leading semiconductor corporations in 2018 has a presence in China, ranging from R&D centers to fabrication sites. This is due to China's vast and expanding demand for chips, which are utilized in both locally produced and consumed items as well as exported goods. According to the Journal of International Commerce and Economics of the United States International Trade Commission, mainland China produces 90% of the world's cellphones, 65% of personal computers, and 67% of smart televisions. China's vast and expanding demand for chips is supported by domestic consumption as well as assembly for export.

The China market dominated the Asia Pacific Wafer Level Packaging Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $1,571 million by 2028. The Japan market is poised to grow at a CAGR of 17.7% during (2022 - 2028). Additionally, The India market would exhibit a CAGR of 19.1% during (2022 - 2028).

Based on End User, the market is segmented into Consumer Electronics, Automotive, Healthcare, IT & Telecommunication, and Others. Based on Type, the market is segmented into WLCSP, 2.5D TSV WLP, 3D TSV WLP, Nano WLP, and Others. Based on Technology, the market is segmented into Fan IN and Fan OUT. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.

Free Valuable Insights: The Worldwide Wafer Level Packaging Market is Projected to reach USD 14.1 Billion by 2028, at a CAGR of 17.7%

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include ASML Holding N.V., Fujitsu Limited, Toshiba Corporation, Qualcomm, Inc., Amkor Technology, Inc., Deca Technologies, Inc., Jiangsu Changjing Electronics Technology Co., Ltd., Tokyo Electron Ltd., Applied Materials, Inc., and Lam Research Corporation.

Scope of the Study

Market Segments Covered in the Report:

By End User

• Consumer Electronics
• Automotive
• Healthcare
• IT & Telecommunication
• Others

ByType

• WLCSP
• 5D TSV WLP
• 3D TSV WLP
• Nano WLP
• Others

By Technology

• Fan IN
• Fan OUT

By Country

• China
• Japan
• India
• South Korea
• Singapore
• Malaysia
• Rest of Asia Pacific

Key Market Players

List of Companies Profiled in the Report:

• ASML Holding N.V.
• Fujitsu Limited
• Toshiba Corporation
• Qualcomm, Inc.
• Amkor Technology, Inc.
• Deca Technologies, Inc.
• Jiangsu Changjing Electronics Technology Co., Ltd.
• Tokyo Electron Ltd.
• Applied Materials, Inc.
• Lam Research Corporation

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Asia Pacific Wafer Level Packaging Market, by End User
1.4.2 Asia Pacific Wafer Level Packaging Market, by Type
1.4.3 Asia Pacific Wafer Level Packaging Market, by Technology
1.4.4 Asia Pacific Wafer Level Packaging Market, by Country
1.5 Methodology for the research

Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints

Chapter 3. Asia Pacific Wafer Level Packaging Market by End User
3.1 Asia Pacific Consumer Electronics Market by Country
3.2 Asia Pacific Automotive Market by Country
3.3 Asia Pacific Healthcare Market by Country
3.4 Asia Pacific IT & Telecommunication Market by Country
3.5 Asia Pacific Others Market by Country

Chapter 4. Asia Pacific Wafer Level Packaging Market by Type
4.1 Asia Pacific WLCSP Market by Country
4.2 Asia Pacific 2.5D TSV WLP Market by Country
4.3 Asia Pacific 3D TSV WLP Market by Country
4.4 Asia Pacific Nano WLP Market by Country
4.5 Asia Pacific Others Market by Country

Chapter 5. Asia Pacific Wafer Level Packaging Market by Technology
5.1 Asia Pacific Fan IN Market by Country
5.2 Asia Pacific Fan OUT Market by Country

Chapter 6. Asia Pacific Wafer Level Packaging Market by Country
6.1 China Wafer Level Packaging Market
6.1.1 China Wafer Level Packaging Market by End User
6.1.2 China Wafer Level Packaging Market by Type
6.1.3 China Wafer Level Packaging Market by Technology
6.2 Japan Wafer Level Packaging Market
6.2.1 Japan Wafer Level Packaging Market by End User
6.2.2 Japan Wafer Level Packaging Market by Type
6.2.3 Japan Wafer Level Packaging Market by Technology
6.3 India Wafer Level Packaging Market
6.3.1 India Wafer Level Packaging Market by End User
6.3.2 India Wafer Level Packaging Market by Type
6.3.3 India Wafer Level Packaging Market by Technology
6.4 South Korea Wafer Level Packaging Market
6.4.1 South Korea Wafer Level Packaging Market by End User
6.4.2 South Korea Wafer Level Packaging Market by Type
6.4.3 South Korea Wafer Level Packaging Market by Technology
6.5 Singapore Wafer Level Packaging Market
6.5.1 Singapore Wafer Level Packaging Market by End User
6.5.2 Singapore Wafer Level Packaging Market by Type
6.5.3 Singapore Wafer Level Packaging Market by Technology
6.6 Malaysia Wafer Level Packaging Market
6.6.1 Malaysia Wafer Level Packaging Market by End User
6.6.2 Malaysia Wafer Level Packaging Market by Type
6.6.3 Malaysia Wafer Level Packaging Market by Technology
6.7 Rest of Asia Pacific Wafer Level Packaging Market
6.7.1 Rest of Asia Pacific Wafer Level Packaging Market by End User
6.7.2 Rest of Asia Pacific Wafer Level Packaging Market by Type
6.7.3 Rest of Asia Pacific Wafer Level Packaging Market by Technology

Chapter 7. Company Profiles
7.1 ASML Holding N.V.
7.1.1 Company Overview
7.1.2 Financial Analysis
7.1.3 Regional Analysis
7.1.4 Research & Development Expenses
7.2 Fujitsu Limited
7.2.1 Company Overview
7.2.2 Financial Analysis
7.2.3 Segmental Analysis
7.2.4 SWOT Analysis
7.3 Toshiba Corporation
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Segmental and Regional Analysis
7.3.4 Research and Development Expense
7.4 Qualcomm, Inc.
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Segmental and Regional Analysis
7.4.4 Research & Development Expense
7.5 Amkor Technology, Inc.
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 Regional Analysis
7.5.4 Research & Development Expense
7.6 Deca Technologies, Inc.
7.6.1 Company Overview
7.6.2 Recent strategies and developments:
7.6.2.1 Partnerships, Collaborations, and Agreements:
7.6.2.2 Product Launches and Product Expansions:
7.7 Jiangsu Changjing Electronics Technology Co., Ltd.
7.7.1 Company Overview
7.8 Tokyo Electron Ltd.
7.8.1 Company Overview
7.8.2 Financial Analysis
7.8.3 Segmental and Regional Analysis
7.8.4 Research & Development Expenses
7.9 Applied Materials, Inc.
7.9.1 Company Overview
7.9.2 Financial Analysis
7.9.3 Segmental and Regional Analysis
7.9.4 Research & Development Expenses
7.10. Lam Research Corporation
7.10.1 Company Overview
7.10.2 Financial Analysis
7.10.3 Regional Analysis
7.10.4 Research & Development Expenses

TABLE 1 Asia Pacific Wafer Level Packaging Market, 2018 - 2021, USD Million
TABLE 2 Asia Pacific Wafer Level Packaging Market, 2022 - 2028, USD Million
TABLE 3 Asia Pacific Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
TABLE 4 Asia Pacific Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
TABLE 5 Asia Pacific Consumer Electronics Market by Country, 2018 - 2021, USD Million
TABLE 6 Asia Pacific Consumer Electronics Market by Country, 2022 - 2028, USD Million
TABLE 7 Asia Pacific Automotive Market by Country, 2018 - 2021, USD Million
TABLE 8 Asia Pacific Automotive Market by Country, 2022 - 2028, USD Million
TABLE 9 Asia Pacific Healthcare Market by Country, 2018 - 2021, USD Million
TABLE 10 Asia Pacific Healthcare Market by Country, 2022 - 2028, USD Million
TABLE 11 Asia Pacific IT & Telecommunication Market by Country, 2018 - 2021, USD Million
TABLE 12 Asia Pacific IT & Telecommunication Market by Country, 2022 - 2028, USD Million
TABLE 13 Asia Pacific Others Market by Country, 2018 - 2021, USD Million
TABLE 14 Asia Pacific Others Market by Country, 2022 - 2028, USD Million
TABLE 15 Asia Pacific Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
TABLE 16 Asia Pacific Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
TABLE 17 Asia Pacific WLCSP Market by Country, 2018 - 2021, USD Million
TABLE 18 Asia Pacific WLCSP Market by Country, 2022 - 2028, USD Million
TABLE 19 Asia Pacific 2.5D TSV WLP Market by Country, 2018 - 2021, USD Million
TABLE 20 Asia Pacific 2.5D TSV WLP Market by Country, 2022 - 2028, USD Million
TABLE 21 Asia Pacific 3D TSV WLP Market by Country, 2018 - 2021, USD Million
TABLE 22 Asia Pacific 3D TSV WLP Market by Country, 2022 - 2028, USD Million
TABLE 23 Asia Pacific Nano WLP Market by Country, 2018 - 2021, USD Million
TABLE 24 Asia Pacific Nano WLP Market by Country, 2022 - 2028, USD Million
TABLE 25 Asia Pacific Others Market by Country, 2018 - 2021, USD Million
TABLE 26 Asia Pacific Others Market by Country, 2022 - 2028, USD Million
TABLE 27 Asia Pacific Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
TABLE 28 Asia Pacific Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
TABLE 29 Asia Pacific Fan IN Market by Country, 2018 - 2021, USD Million
TABLE 30 Asia Pacific Fan IN Market by Country, 2022 - 2028, USD Million
TABLE 31 Asia Pacific Fan OUT Market by Country, 2018 - 2021, USD Million
TABLE 32 Asia Pacific Fan OUT Market by Country, 2022 - 2028, USD Million
TABLE 33 Asia Pacific Wafer Level Packaging Market by Country, 2018 - 2021, USD Million
TABLE 34 Asia Pacific Wafer Level Packaging Market by Country, 2022 - 2028, USD Million
TABLE 35 China Wafer Level Packaging Market, 2018 - 2021, USD Million
TABLE 36 China Wafer Level Packaging Market, 2022 - 2028, USD Million
TABLE 37 China Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
TABLE 38 China Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
TABLE 39 China Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
TABLE 40 China Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
TABLE 41 China Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
TABLE 42 China Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
TABLE 43 Japan Wafer Level Packaging Market, 2018 - 2021, USD Million
TABLE 44 Japan Wafer Level Packaging Market, 2022 - 2028, USD Million
TABLE 45 Japan Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
TABLE 46 Japan Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
TABLE 47 Japan Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
TABLE 48 Japan Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
TABLE 49 Japan Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
TABLE 50 Japan Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
TABLE 51 India Wafer Level Packaging Market, 2018 - 2021, USD Million
TABLE 52 India Wafer Level Packaging Market, 2022 - 2028, USD Million
TABLE 53 India Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
TABLE 54 India Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
TABLE 55 India Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
TABLE 56 India Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
TABLE 57 India Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
TABLE 58 India Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
TABLE 59 South Korea Wafer Level Packaging Market, 2018 - 2021, USD Million
TABLE 60 South Korea Wafer Level Packaging Market, 2022 - 2028, USD Million
TABLE 61 South Korea Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
TABLE 62 South Korea Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
TABLE 63 South Korea Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
TABLE 64 South Korea Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
TABLE 65 South Korea Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
TABLE 66 South Korea Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
TABLE 67 Singapore Wafer Level Packaging Market, 2018 - 2021, USD Million
TABLE 68 Singapore Wafer Level Packaging Market, 2022 - 2028, USD Million
TABLE 69 Singapore Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
TABLE 70 Singapore Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
TABLE 71 Singapore Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
TABLE 72 Singapore Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
TABLE 73 Singapore Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
TABLE 74 Singapore Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
TABLE 75 Malaysia Wafer Level Packaging Market, 2018 - 2021, USD Million
TABLE 76 Malaysia Wafer Level Packaging Market, 2022 - 2028, USD Million
TABLE 77 Malaysia Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
TABLE 78 Malaysia Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
TABLE 79 Malaysia Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
TABLE 80 Malaysia Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
TABLE 81 Malaysia Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
TABLE 82 Malaysia Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
TABLE 83 Rest of Asia Pacific Wafer Level Packaging Market, 2018 - 2021, USD Million
TABLE 84 Rest of Asia Pacific Wafer Level Packaging Market, 2022 - 2028, USD Million
TABLE 85 Rest of Asia Pacific Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
TABLE 86 Rest of Asia Pacific Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
TABLE 87 Rest of Asia Pacific Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
TABLE 88 Rest of Asia Pacific Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
TABLE 89 Rest of Asia Pacific Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
TABLE 90 Rest of Asia Pacific Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
TABLE 91 Key information – ASML Holding N.V.
TABLE 92 Key Information – Fujitsu Limited
TABLE 93 Key Information – Toshiba Corporation
TABLE 94 Key Information – Qualcomm, Inc.
TABLE 95 Key Information – Amkor Technology, Inc.
TABLE 96 Key Information – Deca Technologies, Inc.
TABLE 97 Key Information – Jiangsu Changjing Electronics Technology Co., Ltd.
TABLE 98 Key Information – Tokyo Electron Ltd.
TABLE 99 Key Information – Applied Materials, Inc.
TABLE 100 Key Information – Lam Research Corporation

List of Figures
FIG 1 Methodology for the research
FIG 2 SWOT Analysis: Fujitsu Limited