The Asia Pacific Thermal Interface Materials Market would witness market growth of 11.8% CAGR during the forecast period (2022-2028). The newly discovered class of thermal interface materials delivers ultralow thermal resistance for all the compact power electronics. The heat dissipated per unit area from the electronic devices increases as electronics get more compact and robust, and additional heat is generated by moving components of machinery that operate at higher speeds. Thermal interface materials allow the removal of heat that is produced from the operation of electronic, mechanical devices and electro-chemical devices. This new class of TIMs sinks the heat and increase thermal transfer efficiency by filling the gaps between thermal transfer surfaces like microprocessors and power electronics devices.
This new polymer-based TIMs have been introduced in the chemical industry, which uses boron nitride nanosheet (BNNS) fillers in order to enhance thermal conductivity. BNNS is also known as white graphene which is a two-dimensional crystalline form of hexagonal boron nitride (h-BN). Its shape and geometry is similar to all of its carbon analog graphene but have different properties.
Nowadays, due to an increasing demand and need for thermal management, thermal interface material market is showing a rapid growth. Thermal management is important to maintain the electronic equipment so that they operate smoothly. Further, the industry is expected to grow exceptionally across the globe due to the rise in consumption volume. In the Asian countries, there is greater need for thermal management in the growing medical device industry.
Based on Products, the market is segmented into Greases and Adhesives, Elastomeric Pads, Tapes and films, Metal Based, Phase change materials and Others. Based on Applications, the market is segmented into Computers, Medical Devices, Automotive Electronics, Industrial Machinery, Telecom Equipment, Consumer Durables, and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
Free Valuable Insights: Thermal Interface Materials Market in Asia Pacific is expected to register a CAGR of 11.8% during the forecast period (2022-2028)
The market research report covers theanalysis of key stake holders of the market. Key companies profiled in the report include 3M Company, Honeywell International, Inc., Parker-Hannifin Corporation, Henkel AG & Company, KGaA, Shin-Etsu Chemical Co., Ltd., Indium Corporation, Fuji Polymer Industries Co., Ltd., Momentive Performance, Materials, Inc., Semikron International GmbH, and AIM Specialty Materials
Market Segmentation:
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Companies Profiled
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