The Asia Pacific Rugged IC Market would witness market growth of 5.7% CAGR during the forecast period (2021-2027).
Ruggedized mobile devices are proving to be increasingly beneficial in some industrial industries, like manufacturing sector. Companies with field teams that work in harsh labour and weather situations have discovered a broad range of benefits of rugged devices in a variety of circumstances. These gadgets not only streamline operations but also allow for managed mobility without compromising productivity or quality of work.
Analog integrated circuits, digital integrated circuits, and mixed integrated circuits are the three types of integrated circuits. Digital integrated circuits, which are made up of numerous digital logic gates and other electrical circuit components, are used in computers, microprocessors, digital signal processors, and other frequency counters. Analog integrated circuits (ICs) can be linear or RF, and are typically found in operational amplifiers with a high voltage gain.
The presence of various developing nations like China and India which have a significant manufacturing sector would create opportunities for the market players to invest in this region to expand their revenue share. The industrial supply chain in this region is a vast sector in which complicated actions that need to be take care of at many levels, which involve a wide range of stakeholders who are responsible for specific tasks and outputs.
The China market dominated the Asia Pacific Rugged IC Market by Country 2020, and would continue to be a dominant market till 2027; thereby, achieving a market value of $98.7 million by 2027. The Japan market would showcase a CAGR of 5.1% during (2021 - 2027). Additionally, The India market is anticipated to grow a CAGR of 6.3% during (2021 - 2027).
Based on Level, the market is segmented into Fully Rugged, Semi Rugged and Others. Based on End Use, the market is segmented into Consumer Electronics, Manufacturing, Healthcare, Industrial, Automotive and Others. Based on Application, the market is segmented into Mobile Phones, Tablets, Scanners and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
Free Valuable Insights: The Worldwide Rugged IC Market is Projected to reach USD 1.1 Billion by 2027, at a CAGR of 5.6%
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Crystal Group, Inc., NXP Semiconductors N.V., Qualcomm, Inc., Honeywell International, Inc., Analog Devices, Inc., Infineon Technologies AG, STMicroelectronics N.V., Texas Instruments, Inc., MediaTek, Inc., and General Dynamics Corporation.
Scope of the Study
Market Segments Covered in the Report:
By Level
- Fully Rugged
- Semi Rugged and
- Others
By End Use
- Consumer Electronics
- Manufacturing
- Healthcare
- Industrial
- Automotive and
- Others
By Application
- Mobile Phones
- Tablets
- Scanners and
- Others
By Country
- China
- Japan
- India
- South Korea
- Singapore
- Malaysia
- Rest of Asia Pacific
Key Market Players
List of Companies Profiled in the Report:
- Crystal Group, Inc.
- NXP Semiconductors N.V.
- Qualcomm, Inc.
- Honeywell International, Inc.
- Analog Devices, Inc.
- Infineon Technologies AG
- STMicroelectronics N.V.
- Texas Instruments, Inc.
- MediaTek, Inc.
- General Dynamics Corporation
Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Asia Pacific Rugged IC Market, by Level
1.4.2 Asia Pacific Rugged IC Market, by End Use
1.4.3 Asia Pacific Rugged IC Market, by Application
1.4.4 Asia Pacific Rugged IC Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Competition Analysis - Global
3.1 KBV Cardinal Matrix
3.2 Recent Industry Wide Strategic Developments
3.2.1 Partnerships, Collaborations and Agreements
3.2.2 Product Launches and Product Expansions
3.2.3 Acquisition and Mergers
3.2.4 Geographical Expansions
3.3 Top Winning Strategies
3.3.1 Key Leading Strategies: Percentage Distribution (2017-2021)
3.3.2 Key Strategic Move: (Product Launches and Product Expansions: 2020, Jun – 2021, Aug) Leading Players
Chapter 4. Asia Pacific Rugged IC Market by Level
4.1 Asia Pacific Rugged IC Fully Rugged Market by Country
4.2 Asia Pacific Rugged IC Semi Rugged Market by Country
4.3 Asia Pacific Rugged IC Ultra Rugged Market by Country
Chapter 5. Asia Pacific Rugged IC Market by End Use
5.1 Asia Pacific Consumer Electronics Rugged IC Market by Country
5.2 Asia Pacific Manufacturing Rugged IC Market by Country
5.3 Asia Pacific Healthcare Rugged IC Market by Country
5.4 Asia Pacific Industrial Rugged IC Market by Country
5.5 Asia Pacific Automotive Rugged IC Market by Country
5.6 Asia Pacific Other End Use Rugged IC Market by Country
Chapter 6. Asia Pacific Rugged IC Market by Application
6.1 Asia Pacific Mobile Phones Rugged IC Market by Country
6.2 Asia Pacific Tablets Rugged IC Market by Country
6.3 Asia Pacific Scanners Rugged IC Market by Country
6.4 Asia Pacific Others Rugged IC Market by Country
Chapter 7. Asia Pacific Rugged IC Market by Country
7.1 China Rugged IC Market
7.1.1 China Rugged IC Market by Level
7.1.2 China Rugged IC Market by End Use
7.1.3 China Rugged IC Market by Application
7.2 Japan Rugged IC Market
7.2.1 Japan Rugged IC Market by Level
7.2.2 Japan Rugged IC Market by End Use
7.2.3 Japan Rugged IC Market by Application
7.3 India Rugged IC Market
7.3.1 India Rugged IC Market by Level
7.3.2 India Rugged IC Market by End Use
7.3.3 India Rugged IC Market by Application
7.4 South Korea Rugged IC Market
7.4.1 South Korea Rugged IC Market by Level
7.4.2 South Korea Rugged IC Market by End Use
7.4.3 South Korea Rugged IC Market by Application
7.5 Singapore Rugged IC Market
7.5.1 Singapore Rugged IC Market by Level
7.5.2 Singapore Rugged IC Market by End Use
7.5.3 Singapore Rugged IC Market by Application
7.6 Malaysia Rugged IC Market
7.6.1 Malaysia Rugged IC Market by Level
7.6.2 Malaysia Rugged IC Market by End Use
7.6.3 Malaysia Rugged IC Market by Application
7.7 Rest of Asia Pacific Rugged IC Market
7.7.1 Rest of Asia Pacific Rugged IC Market by Level
7.7.2 Rest of Asia Pacific Rugged IC Market by End Use
7.7.3 Rest of Asia Pacific Rugged IC Market by Application
Chapter 8. Company Profiles
8.1 Crystal Group, Inc.
8.1.1 Company Overview
8.2 NXP Semiconductors N.V.
8.2.1 Company Overview
8.2.2 Financial Analysis
8.2.3 Regional Analysis
8.2.4 Research & Development Expense
8.2.5 Recent strategies and developments:
8.2.5.1 Product Launches and Product Expansions:
8.2.6 SWOT Analysis
8.3 Qualcomm, Inc.
8.3.1 Company Overview
8.3.2 Financial Analysis
8.3.3 Segmental and Regional Analysis
8.3.4 Research & Development Expense
8.3.5 SWOT Analysis
8.4 Honeywell International, Inc.
8.4.1 Company Overview
8.4.2 Financial Analysis
8.4.3 Regional & Segmental Analysis
8.4.4 Research & Development Expenses
8.4.5 SWOT Analysis
8.5 Analog Devices, Inc.
8.5.1 Company Overview
8.5.2 Financial Analysis
8.5.3 Regional Analysis
8.5.4 Research & Development Expenses
8.5.5 Recent strategies and developments:
8.5.5.1 Geographical Expansions:
8.5.6 SWOT Analysis
8.6 Infineon Technologies AG
8.6.1 Company Overview
8.6.2 Financial Analysis
8.6.3 Segmental and Regional Analysis
8.6.4 Research & Development Expense
8.6.5 Recent strategies and developments:
8.6.5.1 Partnerships, Collaborations, and Agreements:
8.6.5.2 Product Launches and Product Expansions:
8.6.5.3 Acquisitions and Mergers:
8.6.6 SWOT Analysis
8.7 STMicroelectronics N.V.
8.7.1 Company Overview
8.7.2 Financial Analysis
8.7.3 Segmental and Regional Analysis
8.7.4 Research & Development Expense
8.7.5 Recent Strategies and Developments:
8.7.5.1 Partnerships, Collaborations and Agreements:
8.7.5.2 Product Launches and Product Expansions:
8.7.6 SWOT Analysis
8.8 General Dynamics Corporation
8.8.1 Company Overview
8.8.2 Financial Analysis
8.8.3 Segmental and Regional Analysis
8.8.4 Research & Development Expense
8.8.5 SWOT Analysis
8.9 Texas Instruments, Inc.
8.9.1 Company Overview
8.9.2 Financial Analysis
8.9.3 Segmental and Regional Analysis
8.9.4 Research & Development Expense
8.9.5 SWOT Analysis
8.10. MediaTek, Inc.
8.10.1 Company Overview
8.10.2 Financial Analysis
8.10.3 Research & Development Expense
8.10.1 Recent strategies and developments:
8.10.1.1 Partnerships, Collaborations, and Agreements:
8.10.1.2 Acquisitions and Mergers:
TABLE 1 Asia Pacific Rugged IC Market, 2017 - 2020, USD Million
TABLE 2 Asia Pacific Rugged IC Market, 2021 - 2027, USD Million
TABLE 3 Partnerships, Collaborations and Agreements– Rugged IC Market
TABLE 4 Product Launches And Product Expansions– Rugged IC Market
TABLE 5 Acquisition and Mergers– Rugged IC Market
TABLE 6 geographical expansions– Rugged IC Market
TABLE 7 Asia Pacific Rugged IC Market by Level, 2017 - 2020, USD Million
TABLE 8 Asia Pacific Rugged IC Market by Level, 2021 - 2027, USD Million
TABLE 9 Asia Pacific Rugged IC Fully Rugged Market by Country, 2017 - 2020, USD Million
TABLE 10 Asia Pacific Rugged IC Fully Rugged Market by Country, 2021 - 2027, USD Million
TABLE 11 Asia Pacific Rugged IC Semi Rugged Market by Country, 2017 - 2020, USD Million
TABLE 12 Asia Pacific Rugged IC Semi Rugged Market by Country, 2021 - 2027, USD Million
TABLE 13 Asia Pacific Rugged IC Ultra Rugged Market by Country, 2017 - 2020, USD Million
TABLE 14 Asia Pacific Rugged IC Ultra Rugged Market by Country, 2021 - 2027, USD Million
TABLE 15 Asia Pacific Rugged IC Market by End Use, 2017 - 2020, USD Million
TABLE 16 Asia Pacific Rugged IC Market by End Use, 2021 - 2027, USD Million
TABLE 17 Asia Pacific Consumer Electronics Rugged IC Market by Country, 2017 - 2020, USD Million
TABLE 18 Asia Pacific Consumer Electronics Rugged IC Market by Country, 2021 - 2027, USD Million
TABLE 19 Asia Pacific Manufacturing Rugged IC Market by Country, 2017 - 2020, USD Million
TABLE 20 Asia Pacific Manufacturing Rugged IC Market by Country, 2021 - 2027, USD Million
TABLE 21 Asia Pacific Healthcare Rugged IC Market by Country, 2017 - 2020, USD Million
TABLE 22 Asia Pacific Healthcare Rugged IC Market by Country, 2021 - 2027, USD Million
TABLE 23 Asia Pacific Industrial Rugged IC Market by Country, 2017 - 2020, USD Million
TABLE 24 Asia Pacific Industrial Rugged IC Market by Country, 2021 - 2027, USD Million
TABLE 25 Asia Pacific Automotive Rugged IC Market by Country, 2017 - 2020, USD Million
TABLE 26 Asia Pacific Automotive Rugged IC Market by Country, 2021 - 2027, USD Million
TABLE 27 Asia Pacific Other End Use Rugged IC Market by Country, 2017 - 2020, USD Million
TABLE 28 Asia Pacific Other End Use Rugged IC Market by Country, 2021 - 2027, USD Million
TABLE 29 Asia Pacific Rugged IC Market by Application, 2017 - 2020, USD Million
TABLE 30 Asia Pacific Rugged IC Market by Application, 2021 - 2027, USD Million
TABLE 31 Asia Pacific Mobile Phones Rugged IC Market by Country, 2017 - 2020, USD Million
TABLE 32 Asia Pacific Mobile Phones Rugged IC Market by Country, 2021 - 2027, USD Million
TABLE 33 Asia Pacific Tablets Rugged IC Market by Country, 2017 - 2020, USD Million
TABLE 34 Asia Pacific Tablets Rugged IC Market by Country, 2021 - 2027, USD Million
TABLE 35 Asia Pacific Scanners Rugged IC Market by Country, 2017 - 2020, USD Million
TABLE 36 Asia Pacific Scanners Rugged IC Market by Country, 2021 - 2027, USD Million
TABLE 37 Asia Pacific Others Rugged IC Market by Country, 2017 - 2020, USD Million
TABLE 38 Asia Pacific Others Rugged IC Market by Country, 2021 - 2027, USD Million
TABLE 39 Asia Pacific Rugged IC Market by Country, 2017 - 2020, USD Million
TABLE 40 Asia Pacific Rugged IC Market by Country, 2021 - 2027, USD Million
TABLE 41 China Rugged IC Market, 2017 - 2020, USD Million
TABLE 42 China Rugged IC Market, 2021 - 2027, USD Million
TABLE 43 China Rugged IC Market by Level, 2017 - 2020, USD Million
TABLE 44 China Rugged IC Market by Level, 2021 - 2027, USD Million
TABLE 45 China Rugged IC Market by End Use, 2017 - 2020, USD Million
TABLE 46 China Rugged IC Market by End Use, 2021 - 2027, USD Million
TABLE 47 China Rugged IC Market by Application, 2017 - 2020, USD Million
TABLE 48 China Rugged IC Market by Application, 2021 - 2027, USD Million
TABLE 49 Japan Rugged IC Market, 2017 - 2020, USD Million
TABLE 50 Japan Rugged IC Market, 2021 - 2027, USD Million
TABLE 51 Japan Rugged IC Market by Level, 2017 - 2020, USD Million
TABLE 52 Japan Rugged IC Market by Level, 2021 - 2027, USD Million
TABLE 53 Japan Rugged IC Market by End Use, 2017 - 2020, USD Million
TABLE 54 Japan Rugged IC Market by End Use, 2021 - 2027, USD Million
TABLE 55 Japan Rugged IC Market by Application, 2017 - 2020, USD Million
TABLE 56 Japan Rugged IC Market by Application, 2021 - 2027, USD Million
TABLE 57 India Rugged IC Market, 2017 - 2020, USD Million
TABLE 58 India Rugged IC Market, 2021 - 2027, USD Million
TABLE 59 India Rugged IC Market by Level, 2017 - 2020, USD Million
TABLE 60 India Rugged IC Market by Level, 2021 - 2027, USD Million
TABLE 61 India Rugged IC Market by End Use, 2017 - 2020, USD Million
TABLE 62 India Rugged IC Market by End Use, 2021 - 2027, USD Million
TABLE 63 India Rugged IC Market by Application, 2017 - 2020, USD Million
TABLE 64 India Rugged IC Market by Application, 2021 - 2027, USD Million
TABLE 65 South Korea Rugged IC Market, 2017 - 2020, USD Million
TABLE 66 South Korea Rugged IC Market, 2021 - 2027, USD Million
TABLE 67 South Korea Rugged IC Market by Level, 2017 - 2020, USD Million
TABLE 68 South Korea Rugged IC Market by Level, 2021 - 2027, USD Million
TABLE 69 South Korea Rugged IC Market by End Use, 2017 - 2020, USD Million
TABLE 70 South Korea Rugged IC Market by End Use, 2021 - 2027, USD Million
TABLE 71 South Korea Rugged IC Market by Application, 2017 - 2020, USD Million
TABLE 72 South Korea Rugged IC Market by Application, 2021 - 2027, USD Million
TABLE 73 Singapore Rugged IC Market, 2017 - 2020, USD Million
TABLE 74 Singapore Rugged IC Market, 2021 - 2027, USD Million
TABLE 75 Singapore Rugged IC Market by Level, 2017 - 2020, USD Million
TABLE 76 Singapore Rugged IC Market by Level, 2021 - 2027, USD Million
TABLE 77 Singapore Rugged IC Market by End Use, 2017 - 2020, USD Million
TABLE 78 Singapore Rugged IC Market by End Use, 2021 - 2027, USD Million
TABLE 79 Singapore Rugged IC Market by Application, 2017 - 2020, USD Million
TABLE 80 Singapore Rugged IC Market by Application, 2021 - 2027, USD Million
TABLE 81 Malaysia Rugged IC Market, 2017 - 2020, USD Million
TABLE 82 Malaysia Rugged IC Market, 2021 - 2027, USD Million
TABLE 83 Malaysia Rugged IC Market by Level, 2017 - 2020, USD Million
TABLE 84 Malaysia Rugged IC Market by Level, 2021 - 2027, USD Million
TABLE 85 Malaysia Rugged IC Market by End Use, 2017 - 2020, USD Million
TABLE 86 Malaysia Rugged IC Market by End Use, 2021 - 2027, USD Million
TABLE 87 Malaysia Rugged IC Market by Application, 2017 - 2020, USD Million
TABLE 88 Malaysia Rugged IC Market by Application, 2021 - 2027, USD Million
TABLE 89 Rest of Asia Pacific Rugged IC Market, 2017 - 2020, USD Million
TABLE 90 Rest of Asia Pacific Rugged IC Market, 2021 - 2027, USD Million
TABLE 91 Rest of Asia Pacific Rugged IC Market by Level, 2017 - 2020, USD Million
TABLE 92 Rest of Asia Pacific Rugged IC Market by Level, 2021 - 2027, USD Million
TABLE 93 Rest of Asia Pacific Rugged IC Market by End Use, 2017 - 2020, USD Million
TABLE 94 Rest of Asia Pacific Rugged IC Market by End Use, 2021 - 2027, USD Million
TABLE 95 Rest of Asia Pacific Rugged IC Market by Application, 2017 - 2020, USD Million
TABLE 96 Rest of Asia Pacific Rugged IC Market by Application, 2021 - 2027, USD Million
TABLE 97 Key information – Crystal Group, Inc.
TABLE 98 Key Information – NXP Semiconductors N.V.
TABLE 99 Key Information – Qualcomm, Inc.
TABLE 100 Key information – Honeywell International, Inc.
TABLE 101 key information – Analog Devices, Inc.
TABLE 102 Key Information – Infineon Technologies AG
TABLE 103 Key Information – STMicroelectronics N.V.
TABLE 104 key information – General Dynamics Corporation
TABLE 105 Key Information – Texas Instruments, Inc.
TABLE 106 Key Information – MediaTek, Inc.
List of Figures
FIG 1 Methodology for the research
FIG 2 KBV Cardinal Matrix
FIG 3 Key Leading Strategies: Percentage Distribution (2017-2021)
FIG 4 Key Strategic Move: (Product Launches and Product Expansions : 2020, Jun – 2021, Aug) Leading Players
FIG 5 Swot analysis: NXP semiconductors N.V.
FIG 6 SWOT Analysis: Qualcomm, Inc.
FIG 7 Swot analysis: Honeywell international, inc.
FIG 8 Swot analysis: analog devices, inc.
FIG 9 Recent strategies and developments: Infineon Technologies AG
FIG 10 Swot analysis: INFINEON TECHNOLOGIES AG
FIG 11 Recent strategies and developments: STMicroelectronics N.V.
FIG 12 Swot analysis: stmicroelectronics n.v.
FIG 13 SWOT Analysis: General Dynamics Corporation
FIG 14 SWOT Analysis: Texas Instruments, Inc.
FIG 15 Recent strategies and developments: MediaTek, Inc.