The LCP Based Molded Interconnect Devices Market is Predicted to reach USD 2.33 Billion by 2032, at a CAGR of 17.0%

LCP Based Molded Interconnect Devices Market Growth, Trends and Report Highlights

According to a new report, published by KBV research, The Global LCP Based Molded Interconnect Devices Market size is expected to reach USD 2.33 billion by 2032, rising at a market growth of 17.0% CAGR during the forecast period.

Molded Interconnect Devices (MIDs) represent an advanced design concept that integrates mechanical and electrical functions into a single three-dimensional structure. Unlike conventional circuit boards that rely on multiple components, wires, and connectors, MIDs enable miniaturized, multifunctional devices by embedding circuitry directly onto molded surfaces. This innovation has reshaped how designers approach product integration in electronics, automotive, and medical sectors, providing both design freedom and material efficiency.

The Laser Direct Structuring (LDS) segment is leading the Global LCP Based Molded Interconnect Devices Market by Process in 2024, growing at a CAGR of 16.5 % during the forecast period. This process is widely recognized for its capability to create detailed conductive circuit traces directly on molded plastic surfaces, allowing for compact, lightweight, and high-precision electronic designs. It supports the growing demand for miniaturized and multifunctional components used in applications such as smartphones, automotive electronics, and communication systems. The method’s ability to integrate mechanical and electrical functions into a single part enhances manufacturing efficiency and reduces assembly complexity.

The Antennas segment is leading the Global LCP Based Molded Interconnect Devices Market by Product in 2024; thereby, achieving a market value of $726.5 million by 2032. These components are integral to modern communication systems, offering high performance, compactness, and superior signal transmission capabilities. The use of LCP materials allows antennas to maintain stability across wide frequency ranges while reducing weight and size. This makes them highly suitable for devices such as smartphones, IoT modules, automotive communication systems, and 5G infrastructure equipment.

The Automotive segment is generating maximum revenue share in the Global LCP Based Molded Interconnect Devices Market by End Use in 2024, growing at a CAGR of 15.5 % during the forecast period. The integration of LCP-based components supports advancements in safety, communication, and infotainment technologies while enabling lightweight and compact designs. These materials are particularly valued for their heat resistance and durability, making them ideal for use in sensors, lighting modules, and control systems. The growing shift toward electric and autonomous vehicles continues to elevate the importance of this segment, as manufacturers increasingly prioritize efficiency and high-performance electronics.

Full Report: https://www.kbvresearch.com/lcp-based-molded-interconnect-devices-market/

The Asia Pacific region dominated the Global LCP Based Molded Interconnect Devices Market by Region in 2024, and would continue to be a dominant market till 2032; thereby, achieving a market value of $858.3 million by 2032. The North America region is experiencing a CAGR of 16.3% during (2025 - 2032). Additionally, The Europe region is e a CAGR of 16.5% during (2025 - 2032).

List of Key Companies Profiled

• Molex, LLC (Koch Industries, Inc.)
• TE Connectivity Ltd.
• Kyocera Corporation
• Amphenol Corporation
• Sumitomo Electric Industries, Ltd.
• Taoglas
• HARTING Technology Group
• LPKF Laser & Electronics SE
• Celanese Corporation
• Solvay SA

LCP Based Molded Interconnect Devices Market Report Segmentation

By Process

• Laser Direct Structuring (LDS)
• Two-Shot Molding
• Other Process

By Product

• Antennas
• Connectors & Interconnects
• Sensor Housings
• Other Product

By End Use

• Automotive
• Consumer Electronics
• Telecommunication
• Aerospace & Defense
• Healthcare
• Other End Use

By Geography

• North America
  • US
  • Canada
  • Mexico
  • Rest of North America
• Europe
  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe
• Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Malaysia
  • Rest of Asia Pacific
• LAMEA
  • Brazil
  • Argentina
  • UAE
  • Saudi Arabia
  • South Africa
  • Nigeria
  • Rest of LAMEA

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