Europe System in Package (SiP) Technology Market expected to grow at a CAGR of 11.7% during 2016-2022

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According to a new report,  Europe System in Package (SiP) Technology Market , published by KBV Research,the Europe System in Package (SiP) Technology Market is would grow at a CAGR of 12.6% during the forecast period.

The 2.5-D IC Packaging market dominated the Europe System in Package (SiP) Technology Market in 2015, and would grow at a CAGR of 11.3% during the forecast period. The 2-D IC PACKAGING market is expected attain a market size of $3.8 billion by 2022.

The Flat Packages market contributed the larger revenue share to the Europe System in Package (SiP) Technology Market in 2015, and would grow at a CAGR of 10.9% during the forecast period. The Pin Grid Arrays market is expected to attain a market size of $2.4 billion by 2022.

The Flip Chip market would reach a market size of $6.2 billion by 2022, growing at a CAGR of 13.9% during the forecast period.

The report highlights the adoption of System in Package (SiP) Technology in Europe.Based on the Type, the Europe System in Package (SiP) Technology market is segmented into 2-D IC Packaging, 2.5-D IC Packaging and 3-D IC Packaging segments. Based on the Packaging Type, the market is bifurcated into Flat Packages, Pin Grid Arrays, Surface Mount, Small Outline Packages and Other Packaging segments. The Europe System in Package (SiP) Technology market is further segmented into Wire Bond, Flip Chip segments based on the Interconnection Technology. Further, the market is segmented into Consumer Electronics, Automotive, Telecommunication, Industrial System, Aerospace & Defenseand Other segments based on the various applications.The countries included in the report are Germany, UK, France, Russia, Spain, Italy and Rest of Europe.

Key Players profiled in the report includes Amkor Technology Inc., Jiangsu Changjiang Electronics Technology Co. Ltd., Chipmos Technologies Inc., Powertech Technology Inc., Ase Group, Renesas Electronics Corporation, Samsung Electronics Co. Ltd. and Toshiba Corporation.

Full report - https://www.kbvresearch.com/europe-system-in-package-sip-technology-market/

Research Scope

The market is segmented based on Type, Packaging Type, Interconnection Technology, Application and Country.

Europe System in Package (SiP) Technology Market, by Type

  • 2-D IC Packaging
  • 5-D IC Packaging
  • 3-D IC Packaging

Europe System in Package (SiP) Technology Market, by Packaging Type

  • Flat Packages
  • Pin Grid Arrays
  • Surface Mount
  • Small Outline Packages
  • Other Packaging

Europe System in Package (SiP) Technology Market, by Interconnection Technology

  • Wire Bond
  • Flip Chip

Europe System in Package (SiP) Technology Market, by Application

  • Consumer Electronics
  • Automotive
  • Telecommunication
  • Industrial System
  • Aerospace &Defense
  • Others

Europe System in Package (SiP) Technology Market, by Country

  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe

Company Profiles

  • Amkor Technology Inc.
  • Jiangsu Changjiang Electronics Technology Co. Ltd.
  • Chipmos Technologies Inc.
  • Powertech Technology Inc.
  • Ase Group
  • Renesas Electronics Corporation
  • Samsung Electronics Co. Ltd.
  • Toshiba Corporation

Related Reports-

Asia Pacific System in Package (SiP) Technology Market

North America System in Package (SiP) Technology Market

Global Systems in Package (SiP) Technology Market

Lamea System in Package (SiP) Technology Market

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