Asia Pacific Power over Ethernet Chipsets Market to register a growth of 11.4% CAGR during the forecast period (2018 - 2024)

13-11-2018 | Report Format: Electronic (PDF)

Growth, Trends and Report Highlights

According to a new report, published by KBV research, the Asia Pacific Power over Ethernet Chipsets Market Size would witness market growth of 11.4% CAGR during the forecast period (2018 - 2024).

The PoE Powered Devices Chipset market dominated the Asia Pacific Power over Ethernet Chipsets Market by Type 2017, growing at a CAGR of 12.3 % during the forecast period. The PoE Power Sourcing Equipment Chipset market is expected to witness a CAGR of 10.3% during (2018 - 2024).

The China market would dominate the Asia Pacific LED Lighting Power over Ethernet Chipsets Market by Country by 2024; growing at a CAGR of 7.9 % during the forecast period. The Japan market is expected to witness a CAGR of 9.6% during (2018 - 2024). Additionally, The India market is expected to witness a CAGR of 11.9% during (2018 - 2024).

The Office Buildings & Small Offices market dominated the Japan Power over Ethernet Chipsets Market by Enterprise Type 2017, thereby, achieving a market value of $17.4 million by 2024. The Hospitality market is expected to witness a CAGR of 10.6% during (2018 - 2024). The Retail market is expected to witness a CAGR of 10.6% during (2018 - 2024). Additionally, The Healthcare market is expected to witness highest CAGR of 11% during (2018 - 2024).

Full Report:https://www.kbvresearch.com/asia-pacific-power-over-ethernet-chipsets-market/

The market research report has exhaustive quantitative insights providing a clear picture of the market potential in various segments across the mentioned countries. The key impacting factors of the market have been discussed in the report with the elaborated company profiles of STMicroelectronics N.V., Silicon Laboratories, Inc., On Semiconductor, Maxim Integrated Products, Inc., Microchip Technology Incorporated, Texas Instruments incorporated, Robert Bosch GmbH, NXP Semicondutor N.V., Microsemi Corporation, and Honeywell International, Inc.