According to a new report Asia Pacific Advanced Packaging Market, published by KBV research, the Asia Pacific Advanced Packaging Market would witness market growth of 12.9% CAGR during the forecast period (2020-2026).
The China market dominated the Asia Pacific Advanced Packaging 2.5D/3D Market by Country 2019. The Japan market is experiencing a CAGR of 13.6% during (2020 - 2026). Additionally, The India market is poised to grow at a CAGR of 14.9% during (2020 - 2026).
The Consumer Electronics market dominated the South Korea Advanced Packaging Market by End User 2019growing at a CAGR of 13.5 % during the forecast period. The Automotive market is estimated to grow at a CAGR of 14.9% during (2020 - 2026). The Industrial market is expected to witness a CAGR of 15.9% during (2020 - 2026). Additionally, The Aerospace & Defense market is showcasing promising CAGR of 16.7% during (2020 - 2026).
The Flip-Chip Ball Grid Array market dominated the Malaysia Advanced Packaging Market by Type 2019, thereby, achieving a market value of $724.8 million by 2026. The Flip Chip CSP market is witnessing a CAGR of 15.8% during (2020 - 2026). Additionally, The Wafer Level CSP market is exhibiting a CAGR of 17.7% during (2020 - 2026).
Structural Insights: https://www.kbvresearch.com/asia-pacific-advanced-packaging-market/
The market research report has exhaustive quantitative insights providing a clear picture of the market potential in various segments across the mentioned countries. The key impacting factors of the market have been discussed in the report with the elaborated company profiles of Qualcomm, Inc., Intel Corporation, IBM Corporation, Texas Instruments, Inc., Analog Devices, Inc., Renesas Electronics Corporation, Samsung Electronics Co., Ltd. (Samsung Group), Amkor Technology, Inc., Brewer Science, Inc., and MICROCHIP Technology, Inc.
By Type
By End-User
By Country
Companies Profiled
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